C8051F813-GM Silicon Laboratories Inc, C8051F813-GM Datasheet - Page 34

IC MCU 8BIT 8KB FLASH 20QFN

C8051F813-GM

Manufacturer Part Number
C8051F813-GM
Description
IC MCU 8BIT 8KB FLASH 20QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F81xr
Datasheet

Specifications of C8051F813-GM

Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Cap Sense, POR, PWM, Temp Sensor, WDT
Number Of I /o
17
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-QFN
Processor Series
C8051F8x
Core
8051
Data Bus Width
16 bit
Data Ram Size
512 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F800DK
Minimum Operating Temperature
- 55 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
336-1786-5
C8051F80x-83x
34
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95 mm openings on a 1.1 mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume.
Body Components.
Figure 4.2. QFN-20 Recommended PCB Land Pattern
Table 4.2. QFN-20 PCB Land Pattern Dimensions
0.20
Min
3.70
3.70
0.50
Max
0.30
Rev. 1.0
Dimension
X2
Y1
Y2
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25

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