MCF52232CAF50 Freescale Semiconductor, MCF52232CAF50 Datasheet - Page 53

• Manufacturer Part Number: MCF52232CAF50
• Description: IC MCU 32BIT 128K FLASH 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5223xr

Specifications of MCF52232CAF50

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Cpu Family: MCF5223x
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 50MHz
• Interface Type: I2C/QSPI/UART
• Total Internal Ram Size: 32KB
• # I/os (max): 56
• Number Of Timers - General Purpose: 10
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 56
• Number Of Timers: 10
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52235EVB, M52233DEMO
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

4
Freescale Semiconductor
4 (May 2007)
3 (Feb 2007)
5 (Sep 2007)
7 (Aug 2008)
6 (Oct 2007)
8 (Jun 2009)
2 (Jul 2006)
Revision
Revision History
• Updated available packages.
• Inserted mechanical drawings.
• Corrected signal pinouts and table.
• Changed signal names TIN to DTIN and TOUT to DTOUT to match the MCF52235 ColdFire
• Added overbars to extend over entire UCTSn and URTSn signal name.
• Added revision history.
• Formatting, layout, spelling, and grammar corrections.
• Updated block diagram and feature information to match Revision 3 of the MCF52235 ColdFire
• Deleted the “PSTCLK cycle time” row from the “Debug AC Timing Specifications” table.
• Added “EPHY Timing” section.
• Deleted the “RAM standby supply voltage” entry from Table 19.
• Changed the minimum value for SNR, THD, SFDR, and SINAD in the “ADC parameters” table (was
• In the “Pin Functions by Primary and Alternate Purpose” table, changed the pin number for IRQ11 on
• Updated the “Thermal characteristics” table to include proper thermal resistance values.
• Added two tables, “Active Current Consumption Specifications” and “Current Consumption
• Changed the value of T
• Added the following note to and above the “Thermal Characteristics” table: “The use of this device in
• Added the value for 
• Formatting, layout, spelling, and grammar corrections.
• Added load test condition information to the “General Purpose I/O Timing” section.
• Added specifications for V
• Formatting, layout, spelling, and grammar corrections.
• Added information about the MCF52232 and MCF52236 devices.
• Revised the part number table to include full Freescale orderable part numbers.
• Synchronized the “Pin Functions by Primary and Alternate Purpose” table in the device reference
• Added specifications for V
• Added several EPHY specifications.
• Formatting, layout, spelling, and grammar corrections.
• Changed the data sheet classification (was “Product Preview”, is “Advance Information”).
• Added the “EzPort Electrical Specifications” section.
• Updated the “ESD Protection” section.
• Changed document type from Advance Information to Technical Data.
• Added supported device list in subtitle.
• Removed preliminary text from electrical specifications section as device is fully characterized.
• Corrected I
• Changed V
• Updated Orderable Part Number Summary table to include MCF52233CAL60A, MCF52235CAL60A,
Microcontroller Reference Manual.
Integrated Microcontroller Reference Manual.
TBD, is “—”).
the 80 LQFP package (was “—”, is 41).
Specifications in Low-Power Modes”, containing the latest current consumption information.
one- or two-layer board designs is not recommended due to the limited thermal conductance provided
by those boards.”
manual and data sheet.
and MCF52236AF50A parts
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
VREFH
OFFSET
, VREFH current unit from “m” to “mA” in ADC specification table.
from TBD to — in ADC specification table.
jt
j
for the 121MAPBGA package (2.0 C/W).
in the “Thermal Characteristics” table (was 105 C, is 130 C for all packages).
Table 41. Revision History
LVD
REFL
and V
, V
REFH
LVDHYS
, and V
Description
to the “DC electrical specifications” table.
DDA
to the “ADC Parameters” table.
Revision History
®
Integrated
®
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