STM32F101T6U6A

Manufacturer Part NumberSTM32F101T6U6A
DescriptionMCU ARM 32BIT 32KB FLASH 36VFQFP
ManufacturerSTMicroelectronics
SeriesSTM32
STM32F101T6U6A datasheet
 


Specifications of STM32F101T6U6A

Core ProcessorARM® Cortex-M3™Core Size32-Bit
Speed36MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDTNumber Of I /o26
Program Memory Size32KB (32K x 8)Program Memory TypeFLASH
Ram Size6K x 8Voltage - Supply (vcc/vdd)2 V ~ 3.6 V
Data ConvertersA/D 10x12bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case36-VFQFN, 36-VFQFPN
Processor SeriesSTM32F101xCoreARM Cortex M3
Data Bus Width32 bitData Ram Size6 KB
Interface TypeI2C, SPI, USARTMaximum Clock Frequency36 MHz
Number Of Programmable I/os26Number Of Timers2
Maximum Operating Temperature+ 85 CMounting StyleSMD/SMT
3rd Party Development ToolsEWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2Minimum Operating Temperature- 40 C
On-chip Adc12 bit, 10 ChannelFeatured ProductSTM32 Cortex-M3 Companion Products
Eeprom Size-For Use With497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS StatusLead free / RoHS CompliantEeprom Size-
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Low-density access line, ARM-based 32-bit MCU with
16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
Features
Core: ARM 32-bit Cortex™-M3 CPU
– 36 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 wait state memory
access
– Single-cycle multiplication and hardware
division
Memories
– 16 to 32 Kbytes of Flash memory
– 4 to 6 Kbytes of SRAM
Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
Low power
– Sleep, Stop and Standby modes
– V
supply for RTC and backup registers
BAT
Debug mode
– Serial wire debug (SWD) and JTAG
interfaces
DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
2
I
Cs and USARTs
1 × 12-bit, 1 µs A/D converter (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
Up to 51 fast I/O ports
– 26/37/51 I/Os, all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant
April 2011
LQFP64
LQFP48
10 x 10 mm
7 x 7 mm
Up to 5 timers
Up to two16-bit timers, each with up to 4
IC/OC/PWM or pulse counter
– 2 watchdog timers (Independent and
Window)
– SysTick timer: 24-bit downcounter
Up to 4 communication interfaces
2
– 1 x I
C interface (SMBus/PMBus)
– Up to 2 USARTs (ISO 7816 interface, LIN,
IrDA capability, modem control)
– 1 × SPI (18 Mbit/s)
CRC calculation unit, 96-bit unique ID
®
ECOPACK
packages
Table 1.
Device summary
Reference
STM32F101x4
STM32F101x6
Doc ID 15058 Rev 5
STM32F101x4
STM32F101x6
VFQFPN48
VFQFPN36
7 × 7 mm
6 × 6 mm
Part number
STM32F101C4,
STM32F101R4,
STM32F101T4
STM32F101C6,
STM32F101R6,
STM32F101T6
1/79
www.st.com
1

STM32F101T6U6A Summary of contents

  • Page 1

    Low-density access line, ARM-based 32-bit MCU with Flash, 5 timers, ADC and 4 communication interfaces Features ■ Core: ARM 32-bit Cortex™-M3 CPU – 36 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state ...

  • Page 2

    Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 3

    STM32F101x4, STM32F101x6 4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 4

    Contents 7 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 8 Revision ...

  • Page 5

    STM32F101x4, STM32F101x6 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 6

    List of tables Table 45. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 7

    STM32F101x4, STM32F101x6 List of figures Figure 1. STM32F101xx Low-density access line block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 8

    List of figures Figure 42. Recommended footprint Figure 43. LQFP64 P max vs 8/79 ( ...

  • Page 9

    ... This datasheet provides the ordering information and mechanical device characteristics of the STM32F101x4 and STM32F101x6 low-density access line microcontrollers. For more details on the whole STMicroelectronics STM32F101xx family, please refer to Full compatibility throughout the The Low-density STM32F101xx datasheet should be read in conjunction with the low-, medium- and high-density STM32F10xxx reference manual ...

  • Page 10

    Description 2 Description The STM32F101x4 and STM32F101x6 Low-density access line family incorporates the high-performance ARM Cortex™-M3 32-bit RISC core operating MHz frequency, high-speed embedded memories (Flash memory Kbytes and SRAM ...

  • Page 11

    STM32F101x4, STM32F101x6 2.1 Device overview Figure 1 shows the general block diagram of the device family. Table 2. Low-density STM32F101xx device features and peripheral counts Peripheral Flash - Kbytes SRAM - Kbytes General-purpose SPI USART 12-bit synchronized ...

  • Page 12

    Description Figure 1. STM32F101xx Low-density access line block diagram TRACECLK TRACED[0: NJTRST JTDI JTCK/SWCLK JTMS/SWDIO JTDO as AF NRST VDDA VSSA 80AF PA[ 15:0] PB[ 15:0] PC[15:0] PD[3:0] MOSI,MISO, SCK,NSS as AF RX,TX, CTS, RTS, Smartcard as AF ...

  • Page 13

    STM32F101x4, STM32F101x6 Figure 2. Clock tree OSC_OUT OSC_IN OSC32_IN OSC32_OUT MCO 1. When the HSI is used as a PLL clock input, the maximum system clock frequency that can be achieved is 36 MHz have an ADC conversion ...

  • Page 14

    Description 2.2 Full compatibility throughout the family The STM32F101xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are referred to as low-density devices, the STM32F101x8 and STM32F101xB ...

  • Page 15

    STM32F101x4, STM32F101x6 2.3 Overview ® 2.3.1 ARM Cortex™-M3 core with embedded Flash and SRAM The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded systems. It has been developed to provide a low-cost platform that meets the ...

  • Page 16

    Description 2.3.6 External interrupt/event controller (EXTI) The external interrupt/event controller consists of 19 edge detector lines used to generate interrupt/event requests. Each line can be independently configured to select the trigger event (rising edge, falling edge, both) and can be ...

  • Page 17

    STM32F101x4, STM32F101x6 than the V threshold. The interrupt service routine can then generate a warning PVD message and/or put the MCU into a safe state. The PVD is enabled by software. Refer to Table 10: Embedded reset and power control ...

  • Page 18

    Description Each channel is connected to dedicated hardware DMA requests, with support for software trigger on each channel. Configuration is made by software and transfer sizes between source and destination are independent. The DMA can be used with the main ...

  • Page 19

    STM32F101x4, STM32F101x6 output compare, PWM or one pulse mode output. This gives input captures / output compares / PWMs on the largest packages. The general-purpose timers can work together via the Timer Link feature for synchronization or ...

  • Page 20

    Description An analog watchdog feature allows very precise monitoring of the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds. 2.3.24 Temperature sensor The temperature sensor has ...

  • Page 21

    STM32F101x4, STM32F101x6 3 Pinouts and pin description Figure 3. STM32F101xx Low-density access line LQFP64 pinout PC13-TAMPER-RTC PC15-OSC32_OUT Figure 4. STM32F101xx Low-density access line LQFP48 pinout PC13-TAMPER-RTC PC15-OSC32_OUT ...

  • Page 22

    Pinouts and pin description Figure 5. STM32F101xx Low-density access line VFQPFN48 pinout PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT PD1-OSC_OUT Figure 6. STM32F101xx Low-density access line VFQPFN36 pinout OSC_IN/PD0 OSC_OUT/PD1 PA0-WKUP 22/ ...

  • Page 23

    STM32F101x4, STM32F101x6 Table 4. Low-density STM32F101xx pin definitions Pins Pin name BAT PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT OSC_IN OSC_OUT NRST ...

  • Page 24

    Pinouts and pin description Table 4. Low-density STM32F101xx pin definitions (continued) Pins Pin name PB2 PB10 PB11 SS_1 DD_1 PB12 ...

  • Page 25

    ... This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available from the STMicroelectronics website: www.st.com. 8. The pins number 2 and 3 in the VFQFPN36 package, and 5 and 6 in the LQFP48 and LQFP64 packages are configured as OSC_IN/OSC_OUT after reset, however the functionality of PD0 and PD1 can be remapped by software on these pins ...

  • Page 26

    Memory mapping 4 Memory mapping The memory map is shown in Figure 7. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex-M3 internal peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 Peripherals 0x4000 ...

  • Page 27

    STM32F101x4, STM32F101x6 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

  • Page 28

    Electrical characteristics Figure 8. Pin loading conditions 5.1.6 Power supply scheme Figure 10. Power supply scheme 1.8-3.6V 5 × 100 × 4.7 µ µF Caution: In Figure ...

  • Page 29

    STM32F101x4, STM32F101x6 5.1.7 Current consumption measurement Figure 11. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 6: Current characteristics, and damage to the device. These are stress ratings only and functional ...

  • Page 30

    Electrical characteristics Table 6. Current characteristics Symbol I Total current into V VDD I Total current out of V VSS Output current sunk by any I/O and control pin I IO Output current source by any I/Os and control pin ...

  • Page 31

    STM32F101x4, STM32F101x6 Table 8. General operating conditions (continued) Symbol Power dissipation °C T Ambient temperature A T Junction temperature range J 1. When the ADC is used, refer recommended to power ...

  • Page 32

    Electrical characteristics . Table 10. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection (2) V PVD hysteresis PVDhyst Power on/power down V POR/PDR reset threshold (2) V PDR hysteresis PDRhyst (2) t Reset ...

  • Page 33

    STM32F101x4, STM32F101x6 5.3.4 Embedded reference voltage The parameters given in temperature and V Table 11. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when reading (1) T S_vrefint the internal reference voltage Internal reference voltage ...

  • Page 34

    Electrical characteristics Table 12. Maximum current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply current Run mode 1. Based on characterization, not tested in production. 2. External clock is 8 MHz ...

  • Page 35

    STM32F101x4, STM32F101x6 Figure 12. Typical current consumption in Run mode versus frequency (at 3 code with data processing running from RAM, peripherals enabled – 45°C Figure 13. Typical current consumption in Run ...

  • Page 36

    Electrical characteristics Table 14. Maximum current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current Sleep mode 1. Based on characterization, tested in production External clock is 8 MHz ...

  • Page 37

    STM32F101x4, STM32F101x6 Figure 14. Typical current consumption values BAT 2.5 2 1.5 1 0.5 0 Figure 15. Typical current consumption in Stop mode with regulator in Run mode versus temperature ...

  • Page 38

    Electrical characteristics Figure 16. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature –45 °C Figure 17. Typical current consumption in Standby mode versus temperature at V ...

  • Page 39

    STM32F101x4, STM32F101x6 Typical current consumption The MCU is placed under the following conditions: ● All I/O pins are in input mode with a static value at V ● All peripherals are disabled except explicitly mentioned ● The ...

  • Page 40

    Electrical characteristics Table 17. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply I current in DD Sleep mode 1. Typical values are measures Add an additional power consumption of 0.8 ...

  • Page 41

    STM32F101x4, STM32F101x6 On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in under the following conditions: ● all I/O pins are in input mode with a static value at V ● all peripherals are disabled unless ...

  • Page 42

    Electrical characteristics Table 19. High-speed external user clock characteristics Symbol User external clock source f HSE_ext frequency V OSC_IN input pin high level voltage HSEH V OSC_IN input pin low level voltage HSEL t w(HSE) OSC_IN high or low time ...

  • Page 43

    STM32F101x4, STM32F101x6 Figure 18. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) External clock source Figure 19. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t r(LSE) External ...

  • Page 44

    Electrical characteristics Table 21. HSE 4-16 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance C versus equivalent serial resistance of the crystal (R i HSE driving current 2 g Oscillator transconductance m (4) ...

  • Page 45

    STM32F101x4, STM32F101x6 resonator manufacturer for more details on the resonator characteristics (frequency, package, accuracy). Table 22. LSE oscillator characteristics (f Symbol Parameter R Feedback resistor F Recommended load capacitance C versus equivalent serial resistance of the crystal (R I LSE ...

  • Page 46

    Electrical characteristics Figure 21. Typical application with a 32.768 kHz crystal Resonator with integrated capacitors 5.3.7 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 23. HSI oscillator ...

  • Page 47

    STM32F101x4, STM32F101x6 Low-speed internal (LSI) RC oscillator Table 24. LSI oscillator characteristics Symbol (2) f Frequency LSI (3) t LSI oscillator startup time su(LSI) (3) I LSI oscillator power consumption DD(LSI –40 to ...

  • Page 48

    Electrical characteristics Table 26. PLL characteristics Symbol t PLL lock time LOCK Jitter Cycle-to-cycle jitter 1. Based on device characterization, not tested in production. 2. Take care of using the appropriate multiplier factors have PLL input clock ...

  • Page 49

    STM32F101x4, STM32F101x6 Functional EMS (Electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: ...

  • Page 50

    Electrical characteristics Electromagnetic Interference (EMI) The electromagnetic field emitted by the device is monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with IEC61967-2 standard which specifies the test board ...

  • Page 51

    STM32F101x4, STM32F101x6 5.3.12 I/O current injection characteristics As a general rule, current injection to the I/O pins, due to external voltage below V above V (for standard, 3 V-capable I/O pins) should be avoided during normal product DD operation. However, ...

  • Page 52

    Electrical characteristics 5.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 34. I/O static characteristics Symbol Parameter Standard IO input low level voltage V IL (1) IO ...

  • Page 53

    STM32F101x4, STM32F101x6 All I/Os are CMOS and TTL compliant (no software configuration required). Their characteristics cover more than the strict CMOS-technology or TTL parameters. The coverage of these requirements is shown in in Figure 24 and Figure 22. Standard I/O ...

  • Page 54

    Electrical characteristics Figure 24 tolerant I/O input characteristics - CMOS port Figure 25 tolerant I/O input characteristics - TTL port 54/79 Doc ID 15058 Rev 5 STM32F101x4, STM32F101x6 ...

  • Page 55

    STM32F101x4, STM32F101x6 Output driving current The GPIOs (general-purpose inputs/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA (with a relaxed V In the user application, the number of I/O pins which can ...

  • Page 56

    Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 36, respectively. Unless otherwise specified, the parameters given in performed under the ambient temperature and V in Table 8. Table 36. I/O AC ...

  • Page 57

    STM32F101x4, STM32F101x6 Figure 26. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved ≤ 2/3)T and if the duty cycle is (45-55%) 5.3.14 NRST pin characteristics The NRST pin ...

  • Page 58

    Electrical characteristics 5.3.15 TIM timer characteristics The parameters given in Refer to Section 5.3.12: I/O current injection characteristics alternate function characteristics (output compare, input capture, external clock, PWM output). Table 38. TIMx Symbol t Timer resolution time res(TIM) Timer external ...

  • Page 59

    STM32F101x4, STM32F101x6 2 Table 39 characteristics Symbol t SCL clock low time w(SCLL) t SCL clock high time w(SCLH) t SDA setup time su(SDA) t SDA data hold time h(SDA) t r(SDA) SDA and SCL rise time t ...

  • Page 60

    Electrical characteristics 2 Figure 28 bus AC waveforms and measurement circuit I²C bus Start SDA t f(SDA) t h(STA) SCL t w(SCLH) 1. Measurement points are done at CMOS levels: 0.3V Table 40. SCL frequency ( ...

  • Page 61

    STM32F101x4, STM32F101x6 SPI interface characteristics Unless otherwise specified, the parameters given in performed under the ambient temperature, f conditions summarized in Refer to Section 5.3.12: I/O current injection characteristics input/output alternate function characteristics (NSS, SCK, MOSI, MISO). Table 41. SPI ...

  • Page 62

    Electrical characteristics Figure 29. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...

  • Page 63

    STM32F101x4, STM32F101x6 Figure 31. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V (1) ...

  • Page 64

    Electrical characteristics 5.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in performed under the ambient temperature, f conditions summarized in Note recommended to perform a calibration after each power-up. Table 42. ADC characteristics Symbol Parameter V ...

  • Page 65

    STM32F101x4, STM32F101x6 Equation 1: R AIN < R ------------------------------------------------------------- - R AIN × ADC The formula above error below 1/4 of LSB. Here (from 12-bit resolution). Table 43. R AIN T (cycles) s 1.5 7.5 ...

  • Page 66

    Electrical characteristics Table 45. ADC accuracy Symbol ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error 1. ADC DC accuracy values are measured after internal calibration. 2. Better performance could be ...

  • Page 67

    STM32F101x4, STM32F101x6 Figure 33. Typical connection diagram using the ADC R AIN (1) V AIN 1. Refer to Table represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the parasitic pad capacitance ...

  • Page 68

    Electrical characteristics 5.3.18 Temperature sensor characteristics Table 46. TS characteristics Symbol ( (1) Avg_Slope ( (2) t START (3)(2) T S_temp 1. Guaranteed by characterization, not tested in production. 2. Guaranteed by design, not tested in ...

  • Page 69

    STM32F101x4, STM32F101x6 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...

  • Page 70

    Package characteristics Figure 35. VFQFPN48 mm, 0.5 mm pitch, package (1) outline Seating Plane Bottom View D2 1. Drawing is not to scale. 2. All leads/pads should also be ...

  • Page 71

    STM32F101x4, STM32F101x6 Figure 37. VFQFPN36 mm, 0.5 mm pitch, package (1) outline Seating plane Pin # 0.20 1. Drawing is not to ...

  • Page 72

    Package characteristics Figure 39. LQFP64 – mm, 64 pin low-profile quad flat package outline Drawing is not to scale. 2. Dimensions are in millimeters. Table 49. LQFP64 – mm, ...

  • Page 73

    STM32F101x4, STM32F101x6 Figure 41. LQFP48 – 7mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is not to scale. ...

  • Page 74

    Package characteristics 6.2 Thermal characteristics The maximum chip junction temperature (T Table 8: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in °C, ● Θ ...

  • Page 75

    STM32F101x4, STM32F101x6 6.2.2 Evaluating the maximum junction temperature for an application When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum ...

  • Page 76

    Ordering information scheme 7 Ordering information scheme Table 52. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 101 = access line Pin count pins ...

  • Page 77

    STM32F101x4, STM32F101x6 8 Revision history Table 53. Document revision history Date Revision 23-Sep-2008 07-Apr-2009 24-Sep-2009 1 Initial release. I/O information clarified on page In Table 4: Low-density STM32F101xx pin PB15, PB3/TRACESWO moved from Default column to Remap column ...

  • Page 78

    Revision history Table 53. Document revision history (continued) Date Revision 20-May-2010 19-Apr-2011 78/79 Added VFQFPN48 package. Updated note 2 below Table 39: I2C characteristics 4 Updated Figure 28: I2C bus AC waveforms and measurement circuit(1) Updated Figure 27: Recommended NRST ...

  • Page 79

    ... STM32F101x4, STM32F101x6 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...