MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 307

• Manufacturer Part Number: MC9S12XET256MAL
• Description: MCU 16BIT 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• On-chip Adc: 16-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 8
S12X Debug (S12XDBGV3) Module
8.1
The S12XDBG module provides an on-chip trace buffer with flexible triggering capability to allow non-
intrusive debug of application software. The S12XDBG module is optimized for the S12X 16-bit
architecture and allows debugging of CPU12Xand XGATE module operations.
Typically the S12XDBG module is used in conjunction with the S12XBDM module, whereby the user
configures the S12XDBG module for a debugging session over the BDM interface. Once configured the
S12XDBG module is armed and the device leaves BDM Mode returning control to the user program,
which is then monitored by the S12XDBG module. Alternatively the S12XDBG module can be configured
over a serial interface using SWI routines.
8.1.1
Freescale Semiconductor
Revision
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
Number
V03.18
V03.19
V03.20
V03.21
V03.22
V03.23
V03.24
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Term
COF
BDM
DUG
Introduction
Revision Date
Glossary
12 Nov 2007
13 Nov 2007
20 Apr 2007
24 Apr 2007
14 Apr 2007
23 Oct 2007
04 Jan 2008
Change Of Flow.
Change in the program flow due to a conditional branch, indexed jump or interrupt
Background Debug Mode
Device User Guide, describing the features of the device into which the DBG is integrated
8.4.2.3/8-331
8.4.3.5/8-333
8.3.2.7/8-319
8.4.2.2/8-331
8.4.2.4/8-332
8.4.5.2/8-336
8.4.5.5/8-343
8.4.5.3/8-338
Sections
Affected
General
MC9S12XE-Family Reference Manual , Rev. 1.23
Table 8-2. Glossary Of Terms
Table 8-1. Revision History
- Added “Data Bus Comparison NDB Dependency” section
- Clarified effect TRIG has on state sequencer.
- Clarified simultaneous arm and disarm effect.
- Clarified reserved State Sequencer encodings.
- Added single databyte comparison limitation information
- Added statement about interrupt vector fetches whilst tagging.
- Removed LOOP1 tracing restriction NOTE.
- Added pin reset effect NOTE.
- Text readability improved, typo removed.
- Corrected bit name.
Definition
Description of Changes
307