MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 888

• Manufacturer Part Number: MC9S12XET256MAL
• Description: MCU 16BIT 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• On-chip Adc: 16-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 24 128 KByte Flash Module (S12XFTM128K2V1)
The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end
at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set.
Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT
register being set. The data value written corresponds to the number of 256 byte sectors allocated for either
direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART).
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1. As defined by the maximum ERPART for FTM256K2.
FERSTAT
Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see
Table
Program a duplicate ERPART to the EEE nonvolatile information register at global address
0x12_0006 (see
Register
FSTAT
24-7)
MGSTAT1
MGSTAT0
EPVIOLIF
ACCERR
Error Bit
FPVIOL
Table
Table 24-76. Partition D-Flash Command Error Handling
24-7)
MC9S12XE-Family Reference Manual , Rev. 1.23
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see
Set if partitions have already been defined
Set if an invalid DFPART or ERPART selection is supplied
None
Set if any errors have been encountered during the read
Set if any non-correctable errors have been encountered during the read
None
Error Condition
Table
24-30)
(1)
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