MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 41

• Manufacturer Part Number: MC9S12XET256MAL
• Description: MCU 16BIT 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• On-chip Adc: 16-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The Version ID is a word located in a flash information row at 0x40_00E8. The version ID number
indicates a specific version of internal NVM variables used to patch NVM errata.
The default is no patch (0xFFFF).
1.2
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
1. The coding is as follows:
2. Currently available as MC9S12XEP100 die only
3. Currently available as MC9S12XEQ512 die only
4. Currently available as MC9S12XET256 die only
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Bit 15-12: Major family identifier
Bit 11-6: Minor family identifier
Bit 5-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor — non full — mask set revision
Signal Description
MC9S12XET256,MC9S12XEG256
MC9S12XET256,MC9S12XEG256
MC9S12XET256,MC9S12XEG256
MC9S12XEP768
MC9S12XEQ384
MC9S12XEG128
MC9S12XEQ384
MC9S12XEG384
MC9S12XEG384
MC9S12XEG128
MC9S12XEP768
MC9S12XES384
MC9S12XES384
MC9S12XEA128
MC9S12XEA128
MC9S12XEQ512
MC9S12XEQ512
MC9S12XEQ512
MC9S12XEQ512
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEP100
MC9S12XEA256
MC9S12XEA256
Device
MC9S12XE-Family Reference Manual Rev. 1.23
(2)
(3)
(4)
2
3
3
3
3
3
4
4
4
Table 1-6. Assigned Part ID Numbers
Mask Set Number
0M22E
1M22E
2M22E
0M48H
1M48H
2M48H
3M48H
4M48H
5M48H
4M48H
5M48H
0M25J
1M25J
2M25J
3M25J
2M25J
3M25J
2M25J
3M25J
2M25J
3M25J
0M53J
1M53J
2M53J
1M53J
2M53J
1M53J
2M53J
1M53J
2M53J
Chapter 1 Device Overview MC9S12XE-Family
Part ID
0xCC80
0xCC80
0xCC82
0xCC90
0xCC91
0xCC92
0xCC93
0xCC94
0xCC94
0xCC94
0xCC94
0xC480
0xC481
0xC482
0xC482
0xC482
0xC482
0xC482
0xC482
0xC482
0xC482
0xC080
0xC081
0xC081
0xC081
0xC081
0xC081
0xC081
0xC081
0xC081
(1)
Version ID
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0x0004
0x0004
0x0004
0x0004
0x0004
0x0004
0x0004
0x0004
0x0004
0x0004
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