MC56F8346VFVER2 Freescale Semiconductor, MC56F8346VFVER2 Datasheet - Page 176

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MC56F8346VFVER2

Manufacturer Part Number
MC56F8346VFVER2
Description
IC HYBRID CTRLR 16BIT 144-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8346VFVER2

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
62
Program Memory Size
136KB (68K x 16)
Program Memory Type
FLASH
Ram Size
6K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
12.3 Power Distribution and I/O Ring Implementation
Figure 12-1
contains two internal power regulators. One of them is powered from the V
be turned off. This regulator controls power to the internal clock generation circuitry. The other regulator
is powered from the V
peripherals and the internal memories. This regulator can be turned off, if an external V
is externally applied to the V
In summary, the entire chip can be supplied from a single 3.3 volt supply if the large core regulator is
enabled. If the regulator is not enabled, a dual supply 3.3V/2.5V configuration can also be used.
Notes:
176
Ensure that capacitor leads and associated printed circuit traces that connect to the chip V
pins are less than 0.5 inch per capacitor lead
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for V
Bypass the V
capacitor such as a tantalum capacitor
Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the V
Take special care to minimize noise levels on the V
Designs that utilize the TRST pin for JTAG port or EOnCE module functionality (such as development or
debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means
to assert TRST independently of RESET. Designs that do not require debugging functionality, such as
consumer products, should tie these pins together.
Because the Flash memory is programmed through the JTAG/EOnCE port, the designer should provide an
interface to this port to allow in-circuit Flash programming
Flash, RAM and internal logic are powered from the core regulator output
V
All circuitry, analog and digital, shares a common V
PP
1 and V
illustrates the general power control incorporated in the 56F8346/56F8146. This chip
DD
and V
PP
DD
2 are not connected in the customer system
and V
DD_IO
SS
circuits.
SS
CAP
pins and provides power to all of the internal digital logic of the core, all
layers of the PCB with approximately 100 μF, preferably with a high-grade
pins.
56F8346 Technical Data, Rev. 15
REF
SS
, V
bus
DDA
and V
SSA
pins
DDA_OSC_PLL
DD
Freescale Semiconductor
and V
DD
DD_CORE
SS
pin and cannot
and V
Preliminary
SS
voltage
(GND)

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