MC9S12XDT256MAA Freescale Semiconductor, MC9S12XDT256MAA Datasheet - Page 786

• Manufacturer Part Number: MC9S12XDT256MAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 59
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 21 External Bus Interface (S12XEBIV2)
21.1.3
Figure 21-1
21.2
The user is advised to refer to the SoC section for port configuration and location of external bus signals.
Table 21-1
and PIM section for reset states of these pins and associated pull-ups or pull-downs.
788
External Signal Description
outlines the pin names and gives a brief description of their function. Refer to the SoC section
Block Diagram
is a block diagram of the XEBI with all related I/O signals.
The following external bus related signals are described in other sections:
CS2, CS1, CS0 (chip selects) — S12X_MMC section
ECLK, ECLKX2 (free-running clocks) — PIM section
TAGHI, TAGLO (tag inputs) — PIM section, S12X_DBG section
EWAIT
MC9S12XDP512 Data Sheet, Rev. 2.21
Figure 21-1. XEBI Block Diagram
XEBI
NOTE
ADDR[22:0]
DATA[15:0]
IVD[15:0]
LSTRB
R/W
UDS
LDS
RE
WE
ACC[2:0]
IQSTAT[3:0]
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