EL5427CR Intersil, EL5427CR Datasheet - Page 12

• Manufacturer Part Number: EL5427CR
• Description: IC BUFFER LP 12CH 2.5MHZ 28TSSOP
• Manufacturer: Intersil

Specifications of EL5427CR

• Amplifier Type: Buffer
• Number Of Circuits: 12
• Output Type: Rail-to-Rail
• Slew Rate: 2.2 V/µs
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 2nA
• Voltage - Input Offset: 1000µV
• Current - Supply: 1.6mA
• Current - Output / Channel: 120mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Gain Bandwidth Product: -

Short Circuit Current Limit
The EL5127, EL5227, EL5327, and EL5427 will limit the
short circuit current to ±120mA if the output is directly
shorted to the positive or the negative supply. If an output is
shorted indefinitely, the power dissipation could easily
increase such that the device may be damaged. Maximum
reliability is maintained if the output continuous current never
exceeds ±30mA. This limit is set by the design of the internal
metal interconnects.
Output Phase Reversal
The EL5127, EL5227, EL5327, and EL5427 are immune to
phase reversal as long as the input voltage is limited from
V
output of the device with the input voltage driven beyond the
supply rails. Although the device's output will not change
phase, the input's overvoltage should be avoided. If an input
voltage exceeds supply voltage by more than 0.6V,
electrostatic protection diodes placed in the input stage of
the device begin to conduct and overvoltage damage could
occur.
Power Dissipation
With the high-output drive capability of the EL5127, EL5227,
EL5327, and EL5427 buffer, it is possible to exceed the
+125°C “absolute-maximum junction temperature” under
certain load current conditions. Therefore, it is important to
calculate the maximum junction temperature for the
S
FIGURE 22. OPERATION WITH RAIL-TO-RAIL INPUT AND
FIGURE 23. OPERATION WITH BEYOND-THE-RAILS INPUT
- -0.5V to V
5V
5V
1V
1V
OUTPUT
S
+ +0.5V. Figure 23 shows a photo of the
12
10µs
10µs
V
T
V
S
A
IN
=25°C
=±5V
=10V
V
T
V
A
S
IN
EL5127, EL5227, EL5327, EL5427
=±2.5V
=25°C
=6V
P-P
P-P
application to determine if load conditions need to be
modified for the buffer to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
P
where:
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
P
when sourcing, and:
P
when sinking.
where:
If we set the two P
can solve for R
power dissipation curves provide a convenient way to see if
the device will overheat. The maximum safe power
dissipation can be found graphically, based on the package
type and the ambient temperature. By using the previous
equation, it is a simple matter to see if P
device's power derating curves.
Unused Buffers
It is recommended that any unused buffer have the input tied
to the ground plane.
DMAX
DMAX
DMAX
T
T
θ
P
i = 1 to Total number of buffers
V
I
V
I
SMAX
LOAD
JA
AMAX
JMAX
DMAX
S
OUT
= Total supply voltage
= Thermal resistance of the package
=
=
=
i = Maximum output voltage of the application
i = Load current
= Maximum quiescent current per channel
= Maximum junction temperature
= Maximum ambient temperature
T
-------------------------------------------- -
Σi V
Σi V
= Maximum power dissipation in the package
JMAX
[
[
S
S
LOAD
Θ
×
×
- T
JA
I
I
SMAX
SMAX
DMAX
AMAX
i to avoid device overheat. The package
+
+
equations equal to each other, we
(
(
V
V
S
OUT
+
- V
i - V
OUT
S
- )
i )
×
DMAX
×
I
I
LOAD
LOAD
exceeds the
i
i ]
]
May 4, 2007
FN7111.4