USBULC6-2F3 STMicroelectronics, USBULC6-2F3 Datasheet - Page 7

• Manufacturer Part Number: USBULC6-2F3
• Description: IC ESD PROTECTION ASD 4FLIPCHIP
• Manufacturer: STMicroelectronics

Specifications of USBULC6-2F3

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Power (watts): 60W
• Polarization: 2 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: 4-FlipChip
• Applications: USB
• Number Of Circuits: 2
• Voltage - Working: 6V
• Technology: Diode Array
• Mounting Style: SMD/SMT
• Diode Type: Low Capacitance
• Power Dissipation Pd: 60W
• Diode Case Style: Flip Chip
• No. Of Pins: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-8166-2; USBULC6-2F3

USBULC6-2F3
Note:
5
Figure 20. Flip Chip tape and reel specifications
More information is available in the application notes:
AN2348: “400 µm Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
Ordering information
Table 3.
Figure 18. Footprint recommendations
USBULC6-2F3
Order code
Solder stencil opening :
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
220 µm recommended
Ordering information
All dimensions in mm
0.71
Marking
EH
Dot identifying Pin A1 location
Package
Flip Chip
User direction of unreeling
Figure 19. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
1.16 mg
Weight
4 ± 0.1
1.02
(y = year
ww = week)
4 ± 0.1
Base qty
5000
Ø 1.5 ± 0.1
Ordering information
x
y
Tape and reel (7”)
Delivery mode
w
x
w
z
7/9