ATSAM3N4AA-MU Atmel, ATSAM3N4AA-MU Datasheet - Page 9

• Manufacturer Part Number: ATSAM3N4AA-MU
• Description: MCU FLASH 48-QFN
• Manufacturer: Atmel
• Series: SAM3Nr

Specifications of ATSAM3N4AA-MU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Processor Series: SAM3N
• Core: ARM Cortex M3
• Data Bus Width: 10 bit
• Interface Type: SPI, UART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 79
• Operating Supply Voltage: 1.62 V to 3.6 V
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

4. Package and Pinout
4.1
4.1.1
4.1.2
11011AS–ATARM–04-Oct-10
SAM3N4/2/1C Package and Pinout
100-lead LQFP Package Outline
100-ball LFBGA Package Outline
SAM3N4/2/1 series is pin-to-pin compatible with SAM3S products. Furthermore SAM3N4/2/1
devices have new functionalities referenced in italic
Figure 4-1.
The 100-Ball LFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimen-
sions are 9 x 9 x 1.1 mm.
Figure 4-2.
Orientation of the 100-lead LQFP Package
Orientation of the 100-ball LFBGA Package
100
76
BALL A1
10
9
8
7
6
5
4
2
3
1
75
A B C D E F G H J K
1
TOP VIEW
inTable
51
25
4-1,
SAM3N Summary
50
26
Table 4-3
and
Table
4-4.
9