MC9S08JE64CLH Freescale Semiconductor, MC9S08JE64CLH Datasheet - Page 14

• Manufacturer Part Number: MC9S08JE64CLH
• Description: IC MCU 8BIT 64K FLASH 64LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JE64CLH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: S08JE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 12 KB
• Maximum Clock Frequency: 48 MHz
• Operating Supply Voltage: - 0.3 V to + 3.8 V
• Maximum Operating Temperature: + 105 C
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: TWR-SER, TWR-ELEV, TWR-MCF51JE-KIT, TWR-S08JE128-KIT, TWR-LCD
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Preliminary Electrical Characteristics
2.3
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. In order to take P
actual pin voltage and V
(heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
is:
14
1
2
3
4
T
θ
P
P
P
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
Junction to Ambient Natural Convection
1s — Single layer board, one signal layer
2s2p — Four layer board, 2 signal and 2 power layers
A
JA
D
int
I/O
Thermal Characteristics
#
1
2
3
4
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
+ P
× V
Symbol
T
SS
I/O
I/O
JMAX
θ
θ
T
DD
JA
JA
or V
A
<< P
, Watts — chip internal power
DD
int
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
and can be neglected. An approximate relationship between P
Operating temperature range (packaged):
Maximum junction temperature
Thermal resistance
Thermal resistance
J
) in °C can be obtained from:
Table 6. Thermal Characteristics
Preliminary — Subject to Change
P
T
D
J
= K ÷ (T
= T
I/O
A
1,2,3,4
1, 2, 3, 4
SS
+ (P
into account in power calculations, determine the difference between
Rating
or V
J
MC9S08JE128
MC9S08JE64
81-pin MBGA
80-pin LQFP
64-pin LQFP
81-pin MBGA
80-pin LQFP
64-pin LQFP
+ 273°C)
D
Single-layer board — 1s
Four-layer board — 2s2p
DD
× θ
will be very small.
JA
)
–40 to 105
–40 to 105
Value
D
135
77
55
68
47
40
49
and T
Freescale Semiconductor
J
(if P
I/O
°C/W
°C/W
Unit
°C
°C
is neglected)
Eqn. 1
Eqn. 2