OPF794 Optek, OPF794 Datasheet - Page 35

• Manufacturer Part Number: OPF794
• Description: Photodiodes Pin Photodiode
• Manufacturer: Optek

Specifications of OPF794

• Maximum Reverse Voltage: 100 V
• Maximum Rise Time: 6 ns
• Mounting Style: SMD/SMT
• Product: Photodiode
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Issue A.1 2005
OPTEK Technology Inc. www.optekinc.com
High-Reliability
H
C
High Temperature
USTOMER
IGH
MIL-PRF-19500:
ESA/SCC/5000:
OPTEK manufactures a wide variety of standard (commercial-off-the-shelf) and custom (built-to-print) assemblies. Most
assemblies can be classified into one of two groups: slotted optical switches or reflective Assemblies.
High reliability assemblies are generally made with plastic housing and hermetically sealed discrete sensors and emitters. Before
being placed in the housing the discrete components are subjected to high-reliability processing. Frequently, this processing on
the discrete device is similar to what is specified on the individual high-reliability sensor and emitter data sheets.
Sometimes, it is necessary to have special electrical selections, screening requirements, or package configuration that is different
from the standard offerings shown in the data sheets. OPTEK’s custom capability is extensive. Assembly and test areas were
designed with a great deal of flexibility, which allows the product to be built and tested on an order-to-order basis. The Quality
Control Department‘s Environmental testing areas are set up similarly, allowing many orders to be handled, each requiring
different tests, screens, and conditions.
MIL-STD-750:
MIL-STD-883:
-R
Reverse Bias
Slotted optical switches are designed to provide non-contact sensing of linear or rotary motion.
Reflective assemblies are designed to provide non-contact sensing of reflective surfaces, or a change in surface reflectivity of
an object.
Level TXV:
Group A:
Group C:
ELIABILITY
Group B:
Level TX:
Level B:
Level S:
(HTRB):
Level
S
PECIFIC
Military specification that establishes uniform methods, controls and procedures for testing microelectronic devices.
All TX units receive process conditioning prior to quality conformance inspection. (See Fig 1)
All TXV units receive process conditioning prior to quality conformance inspection as well as 100% visual inspection. (See Fig 2)
All B units receive process conditioning prior to quality conformance inspection. (See Fig 3)
An ultra-high-reliability device with very strict quality assurance and manufacturing controls imposed. Level S devices are
designed with space applications in mind with the highest product assurance reliability test. (See Fig 4)
European Space Agency specification that defines the general requirements for the qualification approval, procurement,
including lot acceptance testing and delivery of discrete semiconductor components for space applications. (See Fig 5)
Consists of electrical tests and external visual done on a sample basis by Q.C. Prior to submittal to Q.C for Group A
inspection, all devices in the lot are 100% electrically tested in manufacturing.
Consists of tests conducted on a sample basis to verify production lot conformance to package integrity, environmental
extremes, and long-term reliability. The Group B samples are normally selected from the lots that are manufactured within a
six-week time period, based on the date of final package sealing
Is further environmental testing similar to Group B, but sample testing is performed on a periodic basis (typically at six month
intervals.)
Devices are reverse biased in a non-conduction mode at high temperature for a period of time in this test. This test is used
primarily to screen out those devices with inferior semiconductor die characteristics, such as poor voltage breakdown or
leakage current. Ambient temperature is usually specified somewhere between +100°C to +175°C.
Military document that establishes the general requirements for semiconductor devices for a particular series (e.g., 4N22A
military series is spelled out in MIL-PRF-19500/486.)
Military specification that depicts electrical, mechanical, and environmental test procedures and methods for discrete
semiconductors.
A
SSEMBLIES
D
ESIGNS
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