MF1SPLUS6011DUD/03 NXP Semiconductors, MF1SPLUS6011DUD/03 Datasheet - Page 3

• Manufacturer Part Number: MF1SPLUS6011DUD/03
• Description: RFID Modules & Development Tools MIFARE CRYPTO1 AES 848Kbps 2KB
• Manufacturer: NXP Semiconductors

Specifications of MF1SPLUS6011DUD/03

• Security: MIFARE CRYPTO1, AES
• Product: Smart Card
• Data Rate: 848 Kbps
• Antenna: On-Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
5. Ordering information
Table 2.
MF1SPLUSX0Y1_SDS_31
Product short data sheet
PUBLIC
Type number
MF1SPLUS8001DUD/03 FFC
MF1SPLUS8001DA4/03
MF1SPLUS8011DUD/03 FFC
MF1SPLUS8011DA4/03
MF1SPLUS8021DUD/03 FFC
MF1SPLUS8021DA4/03
MF1SPLUS6001DUD/03 FFC
MF1SPLUS6001DA4/03
MF1SPLUS6011DUD/03 FFC
MF1SPLUS6011DA4/03
MF1SPLUS6021DUD/03 FFC
MF1SPLUS6021DA4/03
Ordering information
Package
Commercial
Name
MOA4
MOA4
MOA4
MOA4
MOA4
MOA4
Name
-
-
PLLMC
-
-
-
PLLMC
-
PLLMC
PLLMC
PLLMC
PLLMC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 19 April 2010
Description
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
UID0 = XFh according to ISO/IEC 14443-3
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID, UID0 = XFh according to
ISO/IEC 14443-3
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
UID0 = XFh according to ISO/IEC 14443-3
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID, UID0 = XFh according to
ISO/IEC 14443-3
187031
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
3, 4 kB EEPROM, 7-byte UID
3, 4 kB EEPROM, 4-byte UID
3, 4 kB EEPROM, 4-byte UID,
3, 2 kB EEPROM, 7-byte UID
3, 2 kB EEPROM, 4-byte UID
3, 2 kB EEPROM, 4-byte UID,
Mainstream contactless smart card IC
MF1SPLUSx0y1
© NXP B.V. 2010. All rights reserved.
Version
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
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