HS1-3282-8 Intersil, HS1-3282-8 Datasheet - Page 17

• Manufacturer Part Number: HS1-3282-8
• Description: IC,LINE TRANSCEIVER,CMOS,1 DRIVER,2 RCVR,DIP,40PIN,CERAMIC
• Manufacturer: Intersil

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
246 x 224 x 19 mils)
(6250 x 5700 x 483µm)
Type: Si-Al
Thickness: 11k
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Å
BD15 (11)
BD14 (12)
BD13 (13)
BD12 (14)
BD11 (15)
BD10 (16)
±2k
For information regarding Intersil Corporation and its products, see www.intersil.com
EN1 (10)
D/R2 (7)
SEL (8)
EN1 (9)
Å
HS-3282
199
GLASSIVATION:
WORST CASE CURRENT DENSITY:
Type: SiO
Thickness: 8kA ±1k
2 x 10
5
A/cm
2
2
Å
(36) N/C
(35) N/C
(34) CWSTR
(33) ENTX
(32) 429D0
(31) 429D0
(30) TX/R
(29) PL2
(28) PL1
(27) BD00