ADCLK846BCPZ-REEL7 Analog Devices Inc, ADCLK846BCPZ-REEL7 Datasheet - Page 6

• Manufacturer Part Number: ADCLK846BCPZ-REEL7
• Description: 1.8V 6LVDS/12 CMOS Clock Fanout Buffer
• Manufacturer: Analog Devices Inc
• Type: Fanout Buffer (Distribution)r

Specifications of ADCLK846BCPZ-REEL7

• Design Resources: Synchronizing Multiple AD9910 1 GSPS Direct Digital Synthesizers (CN0121)
• Number Of Circuits: 1
• Ratio - Input:output: 1:6
• Differential - Input:output: Yes/Yes
• Input: CML, CMOS, HSTL, LVDS, LVPECL
• Output: CMOS, LVDS
• Frequency - Max: 1.2GHz
• Voltage - Supply: 1.71 V ~ 1.89 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-LFCSP
• Frequency-max: 1.2GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADCLK846
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Inputs
CLK and CLK
Outputs
Operating Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL PERFORMANCE
Table 6.
Parameter
Junction-to-Ambient Thermal Resistance
Junction-to-Board Thermal Resistance
Junction-to-Case Thermal Resistance
Junction-to-Top-of-Package Characterization Parameter
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
V
CMOS Inputs
Maximum Voltage
Voltage Reference Voltage (V
Ambient
Junction
Storage Temperature Range
Still Air
Moving Air
Moving Air
Moving Air
Still Air
S
0.0 m/sec Airflow
1.0 m/sec Airflow
2.5 m/sec Airflow
1.0 m/sec Airflow
Die-to-Heat Sink
0 m/sec Airflow
to GND
REF
)
Rating
2 V
−0.3 V to +2 V
−0.3 V to +2 V
−0.3 V to +2 V
−0.3 V to +2 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. B | Page 6 of 16
Symbol
θ
θ
θ
θ
Ψ
JA
JMA
JB
JC
JT
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application PCB,
use the following formula:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation.
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations.
ESD CAUTION
J
CASE
JT
is the junction temperature (°C).
is indicated in Table 6.
T
T
is the case temperature (°C) measured by the customer at
J
J
Description
Per JEDEC JESD51-2
Per JEDEC JESD51-6
Per JEDEC JESD51-8
Per MIL-STD 883, Method 1012.1
Per JEDEC JESD51-2
= T
= T
A
is the ambient temperature (°C).
CASE
A
JA
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
+ (Ψ
JA
× PD)
J
JT
by the equation
× PD)
JA
can be used for a first-order
Value
57.0
49.8
44.7
35.2
2.0
1.0
1
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W