EVAL-AD5501EBZ Analog Devices Inc, EVAL-AD5501EBZ Datasheet - Page 8

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EVAL-AD5501EBZ

Manufacturer Part Number
EVAL-AD5501EBZ
Description
Evaluation Board I.c.
Manufacturer
Analog Devices Inc
Datasheet

Specifications of EVAL-AD5501EBZ

Number Of Dac's
1
Number Of Bits
12
Outputs And Type
1, Single Ended
Sampling Rate (per Second)
16M
Data Interface
SPI™, QSPI™, MICROWIRE™, and DSP
Settling Time
45µs
Dac Type
Voltage
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 105°C
Utilized Ic / Part
AD5501
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AD5501
ABSOLUTE MAXIMUM RATINGS
T
100 mA do not cause SCR latch-up.
Table 5.
Parameter
V
V
V
Digital Input to DGND
SDO Output to DGND
AGND to DGND
Maximum Junction Temperature
Storage Temperature Range
Reflow Soldering
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DD
LOGIC
OUT
A
(T
Peak Temperature
Time at Peak Temperature Range
= 25°C, unless otherwise noted. Transient currents of up to
to AGND
J
to AGND
to DGND
Maximum)
Rating
−0.3 V to +64 V
−0.3 V to +7 V
−0.3 V to V
−0.3 V to V
−0.3 V to V
−0.3 V to +0.3 V
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
DD
LOGIC
LOGIC
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. A | Page 8 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Thermal resistance is for a JEDEC 4-layer (2S2P) printed circuit
board (PCB).
Table 6. Thermal Resistance
Package Type
16-Lead TSSOP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
112.60
JA
Unit
°C/W

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