BLF3G21-6 NXP Semiconductors, BLF3G21-6 Datasheet

RF MOSFET Small Signal LDMOS TNS

BLF3G21-6

Manufacturer Part Number
BLF3G21-6
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF3G21-6

Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
2.07 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
+/- 13 V
Continuous Drain Current
2.3 A
Maximum Operating Temperature
+ 200 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
CDIP SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF3G21-6,112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLF3G21-6
Manufacturer:
HITTITE
Quantity:
5 000
Part Number:
BLF3G21-6
Manufacturer:
NXP
Quantity:
3 634
1. Product profile
CAUTION
1.1 General description
1.2 Features
6 W LDMOS power transistor for base station applications at frequencies from
HF to 2200 MHz
Table 1.
I
Table 2.
I
I
I
I
I
I
I
I
Mode of operation
CW
Two-tone
Mode of operation
PHS
Dq
Dq
BLF3G21-6
UHF power LDMOS transistor
Rev. 01 — 25 June 2008
= 90 mA; T
= 200 mA; T
Excellent back-off linearity
Typical PHS performance at a supply voltage of 26 V and I
Easy power control
Excellent ruggedness
High power gain
Excellent thermal stability
Designed for broadband operation (HF to 2200 MHz)
N
N
N
N
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
Average output power = 2 W
Power gain = 16 dB
Efficiency = 20 %
ACPR
Typical class-AB RF performance
Typical class-A RF performance
600k
h
h
= 25 C in a common source test circuit.
= 25 C in a modified PHS test fixture.
= 75 dBc
f
(MHz)
1880 to 1920
f
(MHz)
2000
2000
P
(W)
7
6
< 2
L
P
(W)
2
L(AV)
G
(dB)
12.5
15.5
15.8
p
G
(dB)
16
(%)
43
39
-
D
p
Dq
of 200 mA:
IMD3
(dB)
-
< 50
Product data sheet
(%)
20
32
D
ACPR
(dBc)
75
P
(W)
7
-
-
L(1dB)
600k

Related parts for BLF3G21-6

BLF3G21-6 Summary of contents

Page 1

... BLF3G21-6 UHF power LDMOS transistor Rev. 01 — 25 June 2008 1. Product profile 1.1 General description 6 W LDMOS power transistor for base station applications at frequencies from HF to 2200 MHz Table mA Mode of operation CW Two-tone Table 200 mA Mode of operation PHS CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling ...

Page 2

... Ordering information Package Name Description - ceramic surface-mounted package; 2 leads Limiting values Parameter Conditions drain-source voltage gate-source voltage drain current storage temperature junction temperature Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor Simplified outline Graphic symbol 1 [ Min Max - 65 0 2.3 ...

Page 3

... Dq power gain drain efficiency adjacent channel power ratio (600 kHz) Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor Conditions L(AV) Conditions Min Typ Max Unit = 0. ...

Page 4

... NXP Semiconductors 7.1 Ruggedness in class-AB operation The BLF3G21-6 is capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions 2200 MHz at rated load power (dB mA Fig 1. Power gain as a function of CW load power; typical values (dB mA 2000.1 MHz. 2 Fig 3. ...

Page 5

... BW +ACPR at 600k 192 kHz BW 0 (MHz 1900 MHz Fig 6. 001aai230 1. (GHz Fig 8. Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor iss 10 C oss 5 C rss and C as function of drain supply iss rss oss voltage; typical values ...

Page 6

... Test information output 50 Fig 9. BLF3G21-6_1 Product data sheet V GG C17 Class-AB test circuit for 2 GHz Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor C20 C21 L2 C16 C18 L1 C12 C13 C11 L11 L10 C10 © NXP B.V. 2008. All rights reserved. ...

Page 7

... The components are situated on one side of the copper-clad Printed-Circuit Board (PCB) with Teflon dielectric ( = 2.2); thickness = 0.51 mm. r The other side is unetched and serves as a ground plane. See Table 9 for list of components. Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor C19 C18 C16 L2 C15 C14 C13 ...

Page 8

... mm 0.8 mm; length = 3 mm [3] 50 [3] 34.3 [3] 50 [3] 34.3 [3] 23.6 [3] 5.6 [3] 3.5 [3] 31.9 470 1 k Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor Remarks (L W) 3 1 11 8 1 14 3 12 2.2) ...

Page 9

... REFERENCES JEDEC JEITA Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor 2.03 0.10 0.58 0.25 0.97 0.25 1.27 0.00 0.43 ...

Page 10

... Radio Frequency Surface Mount Device Ultra High Frequency Voltage Standing-Wave Ratio Wideband Code Division Multiple Access Data sheet status Product data sheet Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor Change notice Supersedes - - © NXP B.V. 2008. All rights reserved ...

Page 11

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 25 June 2008 BLF3G21-6 UHF power LDMOS transistor © NXP B.V. 2008. All rights reserved ...

Page 12

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BLF3G21-6 All rights reserved. Date of release: 25 June 2008 Document identifier: BLF3G21-6_1 ...

Related keywords