BAV70W,115 NXP Semiconductors, BAV70W,115 Datasheet - Page 10

• Manufacturer Part Number: BAV70W,115
• Description: DIODE DUAL 100V 175MA H-S SC-70
• Manufacturer: NXP Semiconductors

Specifications of BAV70W,115

• Package / Case: SC-70-3, SOT-323-3
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io) (per Diode): 175mA
• Diode Configuration: 1 Pair Common Cathode
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.175 A
• Max Surge Current: 4 A
• Configuration: Dual Common Cathode
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934024390115::BAV70W T/R::BAV70W T/R

NXP Semiconductors
BAV70_SER_7
Product data sheet
Fig 13. Wave soldering footprint BAV70 (SOT23/TO-236AB)
Fig 14. Reflow soldering footprint BAV70M (SOT883/SC-101)
4.60
Reflow soldering is the only recommended soldering method.
4.00
1.20
0.90
R = 0.05 (12 )
0.20
Rev. 07 — 27 November 2007
0.35
0.25
(2 )
(2 )
solder lands
solder paste
2
3.40
2.80
4.50
0.30
0.40
0.50
(2 )
(2 )
(2 )
3
1.20 (2x)
1
1.30
0.30
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
0.30
0.40
0.50
Dimensions in mm
High-speed switching diodes
solder lands
solder resist
occupied area
BAV70 series
R = 0.05 (12 )
0.60 0.70 0.80
© NXP B.V. 2007. All rights reserved.
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