PSMN9R0-30YL,115 NXP Semiconductors, PSMN9R0-30YL,115 Datasheet - Page 4

• Manufacturer Part Number: PSMN9R0-30YL,115
• Description: MOSFET N-CH 30V 55A LFPAK
• Manufacturer: NXP Semiconductors

Specifications of PSMN9R0-30YL,115

• Package / Case: LFPak-4
• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 8 mOhm @ 15A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 55A
• Vgs(th) (max) @ Id: 2.15V @ 1mA
• Gate Charge (qg) @ Vgs: 17.8nC @ 10V
• Input Capacitance (ciss) @ Vds: 1006pF @ 12V
• Power - Max: 46W
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 55 C
• Configuration: Single Triple Source
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 9 mOhms
• Drain-source Breakdown Voltage: 30 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 61 A
• Power Dissipation: 46 W
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4687-2; 934063067115; PSMN9R0-30YL T/R

NXP Semiconductors
5. Thermal characteristics
Table 5.
PSMN9R0-30YL
Product data sheet
Symbol
R
Fig 4.
th(j-mb)
Z
(K/W)
10
10
th(j-mb)
10
-1
-2
1
10
Transient thermal impedance from junction to mounting base as a function of pulse duration
-6
δ = 0.5
0.2
0.05
0.1
0.02
Thermal characteristics
single shot
Parameter
thermal resistance from
junction to mounting base
10
-5
All information provided in this document is subject to legal disclaimers.
10
-4
Conditions
see
Rev. 04 — 9 March 2011
Figure 4
10
-3
N-channel 30 V 8 mΩ logic level MOSFET in LFPAK
10
-2
PSMN9R0-30YL
Min
-
10
P
-1
t
p
Typ
1.9
T
t
p
© NXP B.V. 2011. All rights reserved.
(s)
003aac544
δ =
Max
2.7
t
T
p
t
1
Unit
K/W
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