BUK7526-100B,127 NXP Semiconductors, BUK7526-100B,127 Datasheet
BUK7526-100B,127
Specifications of BUK7526-100B,127
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BUK7526-100B,127 Summary of contents
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... Rev. 01 — 11 April 2003 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using Philips High-Performance Automotive (HPA) TrenchMOS™ technology. Product availability: BUK7526-100B in SOT78 (TO-220AB) BUK7626-100B in SOT404 (D 1.2 Features Very low on-state resistance 175 C rated 1.3 Applications ...
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Philips Semiconductors 3. Limiting values Table 2: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V drain-source voltage (DC drain-gate voltage (DC) DGR V gate-source voltage (DC drain current (DC) ...
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Philips Semiconductors 120 P der (%) 100 P tot P = ---------------------- - 100% der P tot 25 C Fig 1. Normalized total power dissipation as a function of mounting base temperature ...
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Philips Semiconductors 4. Thermal characteristics Table 3: Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-mb) mounting base R thermal resistance from junction to ambient th(j-a) SOT78 (TO-220AB) 2 SOT404 (D -PAK) 4.1 Transient thermal impedance 1 = ...
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Philips Semiconductors 5. Characteristics Table 4: Characteristics unless otherwise specified. j Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold voltage I GS(th) I drain-source leakage current DSS I gate-source leakage current GSS ...
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Philips Semiconductors Table 4: Characteristics …continued unless otherwise specified. j Symbol Parameter Source-drain diode V source-drain (diode forward) SD voltage t reverse recovery time rr Q recovered charge r 9397 750 11238 Product data Conditions Min ...
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Philips Semiconductors 150 Label ( (A) 20 100 7 6 5 300 Fig 5. Output characteristics: ...
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Philips Semiconductors 5 V GS(th) (V) 4 max 3 typ min - mA Fig 9. Gate-source threshold voltage as a function of junction temperature ...
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Philips Semiconductors 100 175 Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values ...
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Philips Semiconductors 6. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB ( DIMENSIONS (mm are the original dimensions UNIT A 1 4.5 1.39 0.9 1.3 mm ...
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Philips Semiconductors Plastic single-ended surface mounted package (Philips version of D (one lead cropped DIMENSIONS (mm are the original dimensions UNIT c 4.50 1.40 0.85 0.64 mm 4.10 1.27 0.60 0.46 ...
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Philips Semiconductors 7. Soldering handbook, full pagewidth 8.35 8.15 4.85 7.95 Dimensions in mm. Fig 18. Reflow soldering footprint for SOT404. 9397 750 11238 Product data 10.85 10.60 10.50 1.50 7.50 7.40 2.15 2.25 1.50 4.60 0.30 3.00 solder lands ...
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Philips Semiconductors 8. Revision history Table 5: Revision history Rev Date CPCN Description 01 20030411 - Product data (9397 750 11238) 9397 750 11238 Product data BUK75/7626-100B TrenchMOS™ standard level FET Rev. 01 — 11 April 2003 © Koninklijke Philips ...
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Philips Semiconductors Philips Semiconductors 9. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing ...
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Philips Semiconductors Contents 1 Product profi 1.1 Description . . . . . ...