STP11NK40ZFP STMicroelectronics, STP11NK40ZFP Datasheet - Page 6

MOSFET N-CH 400V 9A TO-220FP

STP11NK40ZFP

Manufacturer Part Number
STP11NK40ZFP
Description
MOSFET N-CH 400V 9A TO-220FP
Manufacturer
STMicroelectronics
Series
SuperMESH™r
Datasheet

Specifications of STP11NK40ZFP

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
550 mOhm @ 4.5A, 10V
Drain To Source Voltage (vdss)
400V
Current - Continuous Drain (id) @ 25° C
9A
Vgs(th) (max) @ Id
4.5V @ 100µA
Gate Charge (qg) @ Vgs
32nC @ 10V
Input Capacitance (ciss) @ Vds
930pF @ 25V
Power - Max
30W
Mounting Type
Through Hole
Package / Case
TO-220FP
Transistor Polarity
N Channel
Continuous Drain Current Id
9A
Drain Source Voltage Vds
400V
On Resistance Rds(on)
550mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
3.75V
Rohs Compliant
Yes
Configuration
Single
Resistance Drain-source Rds (on)
0.55 Ohms
Drain-source Breakdown Voltage
400 V
Gate-source Breakdown Voltage
+/- 30 V
Continuous Drain Current
9 A
Power Dissipation
30 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Electrical characteristics
6/17
Table 7.
Table 8.
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300 µs, duty cycle 1.5 %
Table 9.
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the device’s ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve an efficient and cost-effective intervention to protect the device’s
integrity. These integrated Zener diodes thus avoid the usage of external components.
Symbol
Symbol
Symbol
BV
I
t
V
SDM
t
t
r(Voff)
I
d(on)
d(off)
RRM
I
SD
Q
t
t
SD
t
t
t
GSO
c
r
f
f
rr
rr
(2)
(1)
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Off-voltage rise time
Fall time
Cross-over time
Gate-source breakdown voltage Igs=±1mA (open drain)
Source-drain current
Source-drain current (pulsed)
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Source drain diode
Switching times
Gate-source zener diode
Parameter
Parameter
Parameter
Doc ID 8936 Rev 7
V
R
(see Figure 20)
V
R
(see Figure 20)
V
R
(see Figure 20)
I
I
di/dt = 100A/µs,
V
DD
DD
DD
SD
SD
G
G
G
DD
STB11NK40Z, STP11NK40ZFP, STP11NK40Z
=4.7Ω, V
=4.7Ω, V
=4.7Ω, V
Test conditions
=200 V, I
=200V, I
=320V, I
=9A, V
=9A,
Test conditions
Test conditions
=45V, Tj=150°C
GS
GS
D
GS
D
GS
D
=0
=4.5A,
=9A,
=4.5A,
=10V
=10V
=10V
Min.
Min.
Min.
30
-
-
-
-
-
-
-
Typ.
Typ.
225
Typ.
1.6
14
20
20
40
18
15
17
30
-
Max
Max.
Max.
1.6
36
9
-
-
-
-
Unit
Unit
Unit
µC
ns
ns
ns
ns
ns
ns
ns
ns
A
A
V
A
V

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