2PB1424,115 NXP Semiconductors, 2PB1424,115 Datasheet - Page 10

• Manufacturer Part Number: 2PB1424,115
• Description: TRANSISTOR PNP 20V 3.0A SC-62
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of 2PB1424,115

• Package / Case: SC-62, SOT-89, TO-243 (3 Leads + Tab)
• Transistor Type: PNP
• Current - Collector (ic) (max): 3A
• Voltage - Collector Emitter Breakdown (max): 20V
• Vce Saturation (max) @ Ib, Ic: 500mV @ 100mA, 2A
• Dc Current Gain (hfe) (min) @ Ic, Vce: 180 @ 100mA, 2V
• Power - Max: 2W
• Frequency - Transition: 125MHz
• Mounting Type: Surface Mount
• Dc Collector/base Gain Hfe Min: 180
• Gain Bandwidth Product Ft: 125 MHz
• Minimum Operating Temperature: - 65 C
• Configuration: Single
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: - 20 V
• Emitter- Base Voltage Vebo: - 6 V
• Continuous Collector Current: - 3 A
• Maximum Dc Collector Current: - 5 A
• Power Dissipation: 2 W
• Maximum Operating Frequency: 125 MHz
• Maximum Operating Temperature: + 150 C
• Current - Collector Cutoff (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934059291115

NXP Semiconductors
10. Soldering
2PB1424_2
Product data sheet
Fig 15. Reflow soldering footprint SOT89 (SC-62/TO-243)
Fig 16. Wave soldering footprint SOT89 (SC-62/TO-243)
4.60
0.85
SOT89 standard mounting conditions for reflow soldering
Not recommended for wave soldering
1.20
1.20
1.00
(3x)
0.20
1.50
3
6.60
2.40
0.70
5.30
Rev. 02 — 15 January 2007
3
1.20
3.70
3.95
4.75
2.25
2.00
1.90
2
1
2
0.50
1.20
20 V, 3 A PNP low V
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
preferred transport direction during soldering
1.20
1.70
4.85
Dimensions in mm
msa442
CEsat
solder lands
solder resist
occupied area
Dimensions in mm
2PB1424
© NXP B.V. 2007. All rights reserved.
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
msa423
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