MT46V16M16CY-6 IT:K Micron Technology Inc, MT46V16M16CY-6 IT:K Datasheet - Page 16

• Manufacturer Part Number: MT46V16M16CY-6 IT:K
• Description: DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V16M16CY-6 IT:K

• Density: 256 Mb
• Maximum Clock Rate: 333 MHz
• Package: 60FBGA
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 2.5 V
• Maximum Random Access Time: 0.7 ns
• Operating Temperature: -40 to 85 °C
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 700ps
• Operating Supply Voltage (typ): 2.5V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 270mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 10:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
256Mb_DDR_x4x8x16_D2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Solder ball material:
eutectic or SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball pads.
Seating
60X Ø0.45
plane
0.12 A
11 CTR
60-Ball FBGA (8mm x 12.5mm)
Notes:
1 TYP
A
1. Package only available in Die Revision K.
3. Topside part marking decoder can be found on Micron’s Web site.
2. All dimensions are in millimeters.
9 8 7
0.8 TYP
6.4 CTR
8 ±0.15
3 2 1
1
A
B
C
D
E
F
G
H
J
K
L
M
0.8 ±0.1
16
Ball A1 ID
12.5 ±0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR SDRAM
0.25 MIN
1.20 MAX
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID