SP400-0.009-00-11 Bergquist, SP400-0.009-00-11 Datasheet - Page 23

• Manufacturer Part Number: SP400-0.009-00-11
• Description: THERMAL PAD TO-3 .009" SP400
• Manufacturer: Bergquist
• Series: Sil-Pad® 400r

Specifications of SP400-0.009-00-11

• Usage: TO-3, TO-66
• Shape: Rhombus
• Outline: 33.32mm x 19.35mm
• Thickness: 0.009" (0.229mm)
• Backing, Carrier: Fiberglass
• Color: Gray
• Thermal Resistivity: 1.40°C/W
• Thermal Conductivity: 0.9 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 7403-09FR-11; BER218

Where Thermal Solutions Come Together
Bond-Ply
The Bond-Ply family of materials are thermally conductive and electrically isolating.
Bond-Ply is available in a pressure sensitive adhesive or laminating format. Liqui-Bond is a
high thermal performance liquid silicone adhesive that cures to a solid bonding
elastomer. Bond-Ply provides for the mechanical decoupling of bonded materials with
mismatched thermal coefficients of expansion.Typical applications include:
• Bonding bus bars in a variety of electronic modules and sub assemblies
• Attaching a metal-based component to a heat sink
• Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages
• Bonding flexible circuits to a rigid heat spreader or thermal plane
• Assembly tapes for BGA heat spreader
• Attaching PCB assemblies to housings
Top Efficiency In
Thermal Materials For
Today’s Changing Technology.
Contact Bergquist for additional information regarding
our Thermal Solutions.We are constantly innovating
to offer you the greatest selection of options and
flexibility to meet today’s changing technology.
Gap Pad
The Gap Pad product family offers a line of thermally conductive materials which are
highly conformable.Varying degrees of thermal conductivity and compression deflection
characteristics are available.Typical applications include:
• On top of a semiconductor package such as a QFP or BGA. Often times, several
• Between a PCB or substrate and a chassis, frame, or other heat spreader
• Areas where heat needs to be transferred to any type of heat spreader
• For interfacing pressure sensitive devices
• Filling various gaps between heat-generating devices and heat sinks or housings
Gap Pads are available in thickness of 0.010" (0.254mm) to 0.250" (6.35mm), and in cus-
tom shapes, with or without adhesive. Gap Fillers are available in cartridge or kit form.
Device
Power
packages with varying heights can use a common heat sink when utilizing Gap Pad.
®
®
and Gap Filler
Lower Power Application
and Liqui-Bond
with Gap Pad
®
Gap Pad or Gap Filler
FR-4 Board
Heat
Spreader
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