SP400-0.009-00-11 Bergquist, SP400-0.009-00-11 Datasheet - Page 4

• Manufacturer Part Number: SP400-0.009-00-11
• Description: THERMAL PAD TO-3 .009" SP400
• Manufacturer: Bergquist
• Series: Sil-Pad® 400r

Specifications of SP400-0.009-00-11

• Usage: TO-3, TO-66
• Shape: Rhombus
• Outline: 33.32mm x 19.35mm
• Thickness: 0.009" (0.229mm)
• Backing, Carrier: Fiberglass
• Color: Gray
• Thermal Resistivity: 1.40°C/W
• Thermal Conductivity: 0.9 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 7403-09FR-11; BER218

2
Thermal Clad
Key Benefits Of Thermal Clad
The Bergquist Company is the world leader in the develop-
ment and manufacture of thermally conductive interface mate-
rials.Thermal Clad Insulated Metal Substrate (IMS
oped by Bergquist as a thermal management solution for
today’s higher watt-density surface mount applications where
heat issues are a major concern.
Thermal Clad substrates minimize thermal impedance and
conduct heat more effectively and efficiently than standard
printed wiring boards (PWB's). These substrates are more
mechanically robust than thick-film ceramics and direct bond
copper constructions that are often used in these applications.
Thermal Clad is a cost-effective solution which can eliminate
components, allow for simplified designs, smaller devices and an
overall less complicated production processes. Additional ben-
efits of Thermal Clad include lower operating temperatures,
longer component life and increased durability.
Bergquist Thermal Clad substrates are not limited to use with
metal base layers. In one example, power conversion applica-
tions can enhance their performance by replacing FR-4 with
Thermal Clad dielectrics in multi-layer assemblies. In this appli-
cation, the thickness of the copper circuit layer can be mini-
mized by the high thermal performance of Thermal Clad. For
additional information on this topic, refer to the “Specialty
Applications” section on pages 10-11 of this guide.
screws or clamps); a configuration requiring
required use of a large heat sink, interface
material and various hardware (brackets,
Traditionally, cooling an FR-4 board
labor intensive manual assembly.
measured junction temperature
Conventional methods
5W=Tj 43ºC
®
eliminate the need for heat sinks, device
clips, cooling fans and other hardware.
An automated assembly method will
Cooling with Thermal Clad can
®
measured junction temperature
reduce long term costs.
Overview
Thermal Clad
5W=Tj 35ºC
®
) was devel-
Original Power Board Assembly (Actual)
New Power Board Assembly (Actual)
( 66 ) Thru-hole FETs ( 15 ) High profile capacitors ( 9 ) High profile bus bars
Total Weight 3.4 lbs (1543.6 g)
( 48 ) FETs ( 9 ) Low profile capacitors ( 5 ) Low profile bus bars
Total Weight 0.82 lbs (370.6 g)
Thermal Clad is a complete thermal management system, unlike
traditional technology which uses heat sinks, clips and other
mounting hardware. Thermal Clad enables low-cost production
by eliminating the need for costly manual assembly.
Thermal Clad Benefits
• RoHS compliant and halogen-free
• Lower component operating temperatures
• Reduce printed circuit board size
• Increase power density
• Extend the life of dies
• Reduce the number of interconnects
• Improve product thermal and mechanical performance
• Combine power and control
• Improve product durability
• Enable better use of surface mount technology
• Reduce heat sinks and other mounting hardware, including
• Replace fragile ceramic substrates with greater
• Bergquist is your one-stop source from raw materials
thermal interface material
mechanical durability
to finished circuit