SP400-0.009-00-11 Bergquist, SP400-0.009-00-11 Datasheet - Page 24

• Manufacturer Part Number: SP400-0.009-00-11
• Description: THERMAL PAD TO-3 .009" SP400
• Manufacturer: Bergquist
• Series: Sil-Pad® 400r

Specifications of SP400-0.009-00-11

• Usage: TO-3, TO-66
• Shape: Rhombus
• Outline: 33.32mm x 19.35mm
• Thickness: 0.009" (0.229mm)
• Backing, Carrier: Fiberglass
• Color: Gray
• Thermal Resistivity: 1.40°C/W
• Thermal Conductivity: 0.9 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 7403-09FR-11; BER218

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Appendix
ASTM
IEC
IPC
Surface
Mount
ISO 4587
D 149
D 150
D 257
D 374
D 3165
D 5470
60093
60243-1
60250
60626-2
2221
6012
600
TM-650
TM-650-2.4.22
TM-650-2.4.8
SM-840C
ANSI/IPC-SM-782
Adhesives
Test Methods for Dielectric Breakdown Voltage and Dielectric Strength
of Solid Electrical Insulating Materials at Commercial Power Frequencies
Test Methods for AC Loss Characteristics and Permitivity (Dielectric Constant)
of Solid Electrical Insulating Materials
Test Methods for DC Conductance or Impedance of Insulating Materials
Test Methods for Thickness of Solid Electrical Insulation
Test Method for Strength Properties of Adhesives in Shear by Tension
Loading of Single-Lap-Joint Laminated Assemblies
Test Methods for Thermal Transmission Properties of Thin Thermally
Conductive Solid Electrical Insulating Materials
Methods of test for volume resistivity and surface resistivity of
solid electrical insulating materials
Methods of test for electric strength of solid insulating materials -
Part 1:Tests at power frequencies
Recommended methods for the determination of the permitivity and
dielectric dissipation factor of electrical insulating materials at power,
audio, and radio frequencies including metre wavelengths
Combined flexible materials for electrical insulation-
Part 2: Methods of test
Generic Standard on Printed Board Design
Qualifications and Performance Specification of Rigid Printed Boards
Acceptance of Printed Boards
Cleanliness (2.3.35 & 2.3.26)
Bow and Twist
Peel
Soldermask
Surface Mount Land Patterns (configurations and design rules)
Determination of tensile lap-shear strength of rigid-to-rigid
bonded assemblies