PIC12HV609T-I/MS Microchip Technology, PIC12HV609T-I/MS Datasheet - Page 143

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PIC12HV609T-I/MS

Manufacturer Part Number
PIC12HV609T-I/MS
Description
1.75KB Flash, 64B RAM, 6 I/O, 8MHz Internal Oscillator 8 MSOP 3x3mm T/R
Manufacturer
Microchip Technology
Series
PIC® 12Fr

Specifications of PIC12HV609T-I/MS

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Processor Series
PIC12H
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232 , USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details
Other names
PIC12HV609T-I/MSTR
16.0
Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by GPIO ...................................................................................................................... 90 mA
Maximum current sourced GPIO...................................................................................................................... 90 mA
Note 1:
 2010 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
I
OL
DD
).
with respect to V
IK
(1)
OK
(V
DD
............................................................................................................................... 800 mW
I
SS
(Vo < 0 or Vo >V
< 0 or V
pin ......................................................................................................................... 95 mA
pin ...................................................................................................................... 95 mA
SS
PIC12F609/615/617/12HV609/615
I
> V
(†)
................................................................................................... -0.3V to +6.5V
DD
SS
)20 mA
DD
........................................................................... -0.3V to (V
)20 mA
DIS
= V
DD
x {I
DD
–  I
OH
} +  {(V
DD
– V
OH
) x I
DS41302D-page 143
OH
} + (V
DD
+ 0.3V)
O
l x

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