ISP1505ABS STEricsson, ISP1505ABS Datasheet - Page 69

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ISP1505ABS

Manufacturer Part Number
ISP1505ABS
Description
Manufacturer
STEricsson
Datasheet

Specifications of ISP1505ABS

Lead Free Status / RoHS Status
Compliant

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NXP Semiconductors
19. Abbreviations
ISP1505A_ISP1505C_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 57.
Acronym
ASIC
ATX
CD-RW
EOP
ESD
ESR
FS
HBM
HNP
HS
ID
IEC
LS
MO
NRZI
OTG
PCB
PDA
PHY
Fig 29. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Application-Specific Integrated Circuit
Analog USB Transceiver
Compact Disc-ReWritable
End-Of-Packet
ElectroStatic Discharge
Effective Series Resistance
Full-Speed
Human Body Model
Host Negotiation Protocol
High-Speed
Identification
International Electrotechnical Commission
Low-Speed
Magneto-Optical
Non-Return-to-Zero Inverted
On-The-Go
Printed-Circuit Board
Personal Digital Assistant
Physical Layer
Rev. 03 — 26 August 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
ULPI HS USB host and peripheral transceiver
ISP1505A; ISP1505C
temperature
peak
© NXP B.V. 2008. All rights reserved.
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