MT8VDDT6464HG-335F3 Micron Technology Inc, MT8VDDT6464HG-335F3 Datasheet - Page 14

• Manufacturer Part Number: MT8VDDT6464HG-335F3
• Manufacturer: Micron Technology Inc

Specifications of MT8VDDT6464HG-335F3

• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 64Mx64
• Total Density: 512MByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.4A
• Number Of Elements: 8
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Not Compliant

Module Dimensions
Figure 4:
PDF: 09005aef8092973f / Source: 09005aef80921669
DD8C32_64x64H.fm - Rev. D 9/08 EN
2.0 (0.079) R
1.8 (0.071)
2.0 (0.079) TYP
(2X)
6.0 (0.236) TYP
(2X)
200-Pin SODIMM – Layout 1 (256MB)
Notes:
Pin 1
1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for addi-
Pin 200
U1
tional design dimensions.
1.0 (0.039)
U8
TYP
U2
U7
Front view
Back view
63.60 (2.504)
67.75 (2.667)
67.45 (2.656)
256MB, 512MB (x64, SR) 200-Pin DDR SDRAM SODIMM
TYP
0.45 (0.018)
TYP
U3
U6
14
0.60 (0.024)
TYP
15.35 (0.604)
U4
U5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
TYP
U9
4.0 (0.157) TYP
Pin 199
Pin 2
20.0 (0.787)
TYP
Module Dimensions
©2004 Micron Technology, Inc. All rights reserved.
31.9 (1.256)
31.6 (1.244)
3.8 (0.15)
1.1 (0.043)
0.9 (0.035)
MAX