MT8VDDT6464HG-335F3 Micron Technology Inc, MT8VDDT6464HG-335F3 Datasheet - Page 2

• Manufacturer Part Number: MT8VDDT6464HG-335F3
• Manufacturer: Micron Technology Inc

Specifications of MT8VDDT6464HG-335F3

• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 64Mx64
• Total Density: 512MByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.4A
• Number Of Elements: 8
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Not Compliant

Table 2:
Table 3:
Table 4:
PDF: 09005aef8092973f / Source: 09005aef80921669
DD8C32_64x64H.fm - Rev. D 9/08 EN
Parameter
Part Number
Part Number
Refresh count
Row address
Device bank address
Device configuration
Column address
Module rank address
MT8VDDT3264HG-40B__
MT8VDDT3264HY-40B__
MT8VDDT3264HG-335__
MT8VDDT3264HY-335__
MT8VDDT3264HG-262__
MT8VDDT3264HG-26A__
MT8VDDT3264HG-265__
MT8VDDT3264HY-265__
MT8VDDT6464HG-40B__
MT8VDDT6464HY-40B__
MT8VDDT6464HG-335__
MT8VDDT6464HY-335__
MT8VDDT6464HG-265__
MT8VDDT6464HY-265__
Addressing
Part Numbers and Timing Parameters – 256MB
Base device: MT46V32M8,
Part Numbers and Timing Parameters – 512MB
Base device: MT46V64M8,
2
2
Notes:
1. Data sheets for the base devices can be found on Micron’s Web site.
2. All part numbers end with a two-place code (not shown) that designates component and
PCB revisions. Consult factory for current revision codes. Example: MT8VDDT6464HY-335F3.
Module
Density
Module
Density
256MB
256MB
256MB
256MB
256MB
256MB
256MB
256MB
512MB
512MB
512MB
512MB
512MB
512MB
1
1
256Mb DDR SDRAM
512Mb DDR SDRAM
256MB, 512MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Configuration
Configuration
32 Meg x 64
64 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
64 Meg x 64
64 Meg x 64
64 Meg x 64
64 Meg x 64
64 Meg x 64
2
256Mb (32 Meg x 8)
4 (BA0, BA1)
8K (A0–A12)
Bandwidth
Bandwidth
1K (A0–A9)
Module
Module
256MB
3.2 GB/s
3.2 GB/s
2.7 GB/s
2.7 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
3.2 GB/s
3.2 GB/s
2.7 GB/s
2.7 GB/s
2.1 GB/s
2.1 GB/s
1 (S0#)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
8K
Memory Clock/
Memory Clock/
5.0ns/400 MT/s
5.0ns/400 MT/s
6.0ns/333 MT/s
6.0ns/333 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
5.0ns/400 MT/s
5.0ns/400 MT/s
6.0ns/333 MT/s
6.0ns/333 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
Data Rate
Data Rate
©2004 Micron Technology, Inc. All rights reserved.
512Mb (64 Meg x 8)
2K (A0–A9, A11)
4 (BA0, BA1)
8K (A0–A12)
512MB
1 (S0#)
8K
(CL-
(CL-
Clock Cycles
Clock Cycles
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
t
t
3-3-3
3-3-3
2-2-2
2-3-3
3-3-3
3-3-3
RCD-
RCD-
Features
t
t
RP)
RP)