ISL22444TFV20Z Intersil, ISL22444TFV20Z Datasheet - Page 3

• Manufacturer Part Number: ISL22444TFV20Z
• Description: IC POT DGTL 256TP LN LP 20-TSSOP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of ISL22444TFV20Z

• Taps: 256
• Resistance (ohms): 100K
• Number Of Circuits: 4
• Temperature Coefficient: 45 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Resistance In Ohms: 100K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pin Descriptions
* Note: PCB thermal land for QFN EPAD should be connected to V- plane or left floating. For more information refer to
http://www.intersil.com/data/tb/TB389.pdf
TSSOP PIN
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
QFN PIN
EPAD*
19
20
10
12
13
14
15
16
17
18
11
1
2
3
4
5
6
7
8
9
3
SYMBOL
RW3
SDO
GND
RW2
RW1
RW0
RH3
SCK
RH2
RH1
VCC
RH0
RL3
RL2
RL1
RL0
SDI
NC
CS
V-
“High” terminal of DCP3
“Low” terminal of DCP3
“Wiper” terminal of DCP3
No connection
SPI interface clock input
Data Output of the SPI serial interface
Device ground pin
“Wiper” terminal of DCP2
“Low” terminal of DCP2
“High” terminal of DCP2
“Wiper” terminal of DCP1
“Low” terminal of DCP1
“High” terminal of DCP1
Chip Select active low input
Data Input of the SPI serial interface
Positive power supply pin
Negative power supply pin
“High” terminal of DCP0
“Low” terminal of DCP0
“Wiper” terminal of DCP0
Exposed Die Pad internally connected to V-
ISL22444
DESCRIPTION
May 24, 2007
FN6426.0