0W633-001-XTP ON Semiconductor, 0W633-001-XTP Datasheet - Page 32

IC AUDIO PROCESSOR AD/DA 57LFBGA

0W633-001-XTP

Manufacturer Part Number
0W633-001-XTP
Description
IC AUDIO PROCESSOR AD/DA 57LFBGA
Manufacturer
ON Semiconductor
Series
BelaSigna® 250r
Type
Floating Pointr
Datasheet

Specifications of 0W633-001-XTP

Interface
I²C, I²S, PCM, SPI, UART
Clock Rate
50MHz
On-chip Ram
42kB
Voltage - I/o
1.0V, 2.0V
Voltage - Core
1.00V, 2.00V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
57-LFBGA
Package
57CABGA
Numeric And Arithmetic Format
Fixed-Point
Ram Size
16 KB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Non-volatile Memory
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
0W633-001-XTP
Manufacturer:
MAXIM
Quantity:
4 300
Part Number:
0W633-001-XTP
Manufacturer:
ON Semiconductor
Quantity:
10 000
2X
NOTE 3
2X
0.05
0.03 C
0.05 C
0.10 C
C
48X
0.10 C
0.10 C
A
A1
B
b
B
E
D
C
B
A
F
E
8
7
e/2
BOTTOM VIEW
e
6
SIDE VIEW
TOP VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
5
D
4
3
2
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
1
PITCH
È È
WLCSP48, 3.80x2.58
0.40
http://onsemi.com
RECOMMENDED
CASE 567AS−01
e
ISSUE B
A
A2
REFERENCE
A
PIN A1
32
e/2
C
SEATING
PLANE
DIMENSIONS: MILLIMETERS
A1
PACKAGE
OUTLINE
48X
0.25
0.40
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
ASME Y14.5M, 1994.
CROWNS OF SOLDER BALLS.
DIM
A1
A2
A
C
D
b
E
e
MILLIMETERS
MIN
0.84
0.17
0.24
0.125 BSC
0.72 REF
3.80 BSC
2.58 BSC
0.40 BSC
MAX
1.00
0.23
0.29

Related parts for 0W633-001-XTP