MPC8241LVR200D Freescale Semiconductor, MPC8241LVR200D Datasheet - Page 53

• Manufacturer Part Number: MPC8241LVR200D
• Description: IC MPU 32BIT 200MHZ PPC 357-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerPCr

Specifications of MPC8241LVR200D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xxx
• Core: 603e
• Maximum Clock Frequency: 200 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 200MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 357
• Supply Voltage Range: 1.14V To 1.26V
• Operating Temperature Range: 0°C To +105°C
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

8.1
Table 19
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier that may specify special application conditions. Each part number also
contains a revision code that refers to the die mask revision number. Read the Revision ID register at
address offset 0x08 to determine the revision level.
8.2
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate hardware specifications addendums that supplement and supersede this document
(see
Freescale Semiconductor
Notes:
1. See
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
Product
MPC
Code
Product
specification support all core frequencies. Additionally, parts addressed by hardware specifications addendums may support
other maximum core frequencies.
MPC
Code
MPC
Table
Section 5, “Package Description,”
provides the Freescale part numbering nomenclature for the MPC8241. Note that the individual
Part Numbers Fully Addressed by This Document
Part Numbers Not Fully Addressed by This Document
Identifier
20).
nnnn
Part
Identifier
nnnn
8241
Part
Process Descriptor
Table 20. Part Numbers Addressed by MPC8241TXXPNS Series
L = Standard spec.
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Process Descriptor
0° to 105°C
T
L
Table 19. Part Numbering Nomenclature
(Document No. MPC8241ECSO1AD))
for more information on available package types.
ZQ = thick substrate and thick
mold cap PBGA (two layers)
ZQ = thick substrate and thick
mold cap PBGA (four layers,
thermally enhanced)
VR = Lead-free version of package
Package
xx
1
Package
xx
1
Frequency
Processor
nnn
(MHz)
2
1.8 V ± 100 mV
1.8 V ± 100 mV
1.8 V ± 100 mV
166, 200, 266
Frequency
Processor
166, 200
(MHz)
nnn
Revision
266
Level
x
2
Ordering Information
D:1.4 = Rev.
ID:0x14
Processor
Revision
Register
Version
Value
Level
x
53