XPC8260CZUHFBC Freescale Semiconductor, XPC8260CZUHFBC Datasheet - Page 12

• Manufacturer Part Number: XPC8260CZUHFBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8260CZUHFBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 166MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 133MHz
• Embedded Interface Type: I2C, MII, SPI, TDM, UTOPIA
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Electrical and Thermal Characteristics
2.2
Table 4
2.3
The average chip-junction temperature
where
For most applications P
T
Solving equations (1) and (2) for K gives:
12
J
is the following:
2
3
1
2
3
4
5
The leakage current is measured for nominal VDD, VCCSYN, and VDD.
MPC8265 and MPC8266 only.
Junction to ambient
Junction to board
Junction to case
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
T
T
θ
P
P
P
P
K = P
Assumes a single layer board with no thermal vias
Natural convection
Assumes a four layer board
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
describes thermal characteristics.
A
D
INT
I/O
D
JA
J
Thermal Characteristics
Power Considerations
= T
= ambient temperature °C
= P
= K/(T
= package thermal resistance
= power dissipation on input and output pins (determined by user)
= I
D
A
INT
DD
x (T
+ (P
Characteristics
J
+ P
x V
+ 273° C)
A
D
5
+ 273° C) +
I/O
x
4
DD
θ
I/O
JA
Watts (chip internal power)
Table 4. Thermal Characteristics for 480 TBGA Package
)
< 0.3 x P
θ
JA
x P
INT
,
junction to ambient
,
D
. If P
T
2
J
,
in °C can be obtained from the following:
Symbol
I/O
θ
θ
θ
JA
JB
JC
is neglected
,
°C/W
,
Value
an approximate relationship between P
13
10
11
1.1
8
4
3
1
1
3
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor
Air Flow
1 m/s
1 m/s
NC
NC
—
—
2
(2)
(1)
(3)
D
and