XPC8260CZUHFBC Freescale Semiconductor, XPC8260CZUHFBC Datasheet - Page 34

• Manufacturer Part Number: XPC8260CZUHFBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8260CZUHFBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 166MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 133MHz
• Embedded Interface Type: I2C, MII, SPI, TDM, UTOPIA
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Pinout
Figure 14
Table 21
Table
Symbols used in
34
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
OVERBAR
UTM
UTS
UT8
UT16
MII
21.
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
shows the pinout list of the MPC826xA.
shows the side profile of the TBGA package to indicate the direction of the top surface view.
Soldermask
1.27 mm Pitch
Table 21
Polymide Tape
Symbol
are described in
(Oxidized for Insulation)
Copper Heat Spreader
Pin Name
Figure 14. Side View of the TBGA Package
Table 20. Symbol Legend
Glob-Top Dam
Table 21. Pinout List
Table
Signals with overbars, such as TA, are active low.
Indicates that a signal is part of the UTOPIA master interface.
Indicates that a signal is part of the UTOPIA slave interface.
Indicates that a signal is part of the 8-bit UTOPIA interface.
Indicates that a signal is part of the 16-bit UTOPIA interface.
Indicates that a signal is part of the media independent interface.
20.
Glob-Top Filled Area
Table 20
View
Die
Wire Bonds
defines conventions and acronyms used in
Attach
Die
Meaning
W5
F4
E2
E3
G1
H5
H2
H1
J5
J4
J3
J2
Copper Traces
Cavity
Etched
Pressure Sensitive
Ball
Adhesive
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