XPC8260CZUHFBC Freescale Semiconductor, XPC8260CZUHFBC Datasheet - Page 46

• Manufacturer Part Number: XPC8260CZUHFBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8260CZUHFBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 166MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 133MHz
• Embedded Interface Type: I2C, MII, SPI, TDM, UTOPIA
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Package Description
5
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
5.1
Package parameters are provided in
46
3
4
5
6
On PCI devices (MPC8265 and MPC8266) this pin should be used as CLKIN2. On non-PCI devices (MPC8260A and
MPC8264) this is a spare pin that must be pulled down or left floating.
Must be pulled down or left floating.
On PCI devices (MPC8265 and MPC8266) this pin should be asserted if the PCI function is desired or pulled up or
left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled
up or left floating.
For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at
www.freescale.com.
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Package Description
Package Parameters
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
Parameter
Table
Table 22. Package Parameters
22. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
37.5 × 37.5 mm
480 (29 × 29 ball array)
1.27 mm
Value
Freescale Semiconductor