MPC8313CVRAFFB Freescale Semiconductor, MPC8313CVRAFFB Datasheet - Page 63

IC MPU POWERQUICC II PRO 516PBGA

MPC8313CVRAFFB

Manufacturer Part Number
MPC8313CVRAFFB
Description
IC MPU POWERQUICC II PRO 516PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8313CVRAFFB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
333MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8313E-RDB
Maximum Clock Frequency
333 MHz
Operating Supply Voltage
- 0.3 V to + 1.26 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
2.5 V
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
Program Memory Type
EEPROM/Flash
For Use With
MPC8313E-RDB - BOARD PROCESSOR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8313CVRAFFB
Manufacturer:
FREESCAL
Quantity:
120
Part Number:
MPC8313CVRAFFB
Manufacturer:
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Quantity:
10 000
Part Number:
MPC8313CVRAFFB
Manufacturer:
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Figure 55
19 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8313E is available in
a thermally enhanced plastic ball grid array (TEPBGAII), see
MPC8313E TEPBGAII,”
information on the TEPBGAII.
19.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm,
516 TEPBGAII.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
SPICLK (Output)
Package Parameters for the MPC8313E TEPBGAII
shows the SPI timing in master mode (internal clock).
Output Signals:
Note: The clock edge is selectable on SPI.
Input Signals:
(See Note)
(See Note)
SPIMISO
SPIMOSI
MPC8313E PowerQUICC
Figure 55. SPI AC Timing in Master Mode (Internal Clock) Diagram
and
Section 19.2, “Mechanical Dimensions of the MPC8313E TEPBGAII,”
t
NIIVKH
II Pro Processor Hardware Specifications, Rev. 3
t
NIKHOV
t
NIIXKH
27 mm × 27 mm
516
1.00 mm
2.25 mm
95.5 Sn/0.5 Cu/4 Ag (VR package),
62 Sn/36 Pb/2 Ag (ZQ package)
0.6 mm
Section 19.1, “Package Parameters for the
Package and Pin Listings
for
63

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