UJA1076TW/3V3/WD:1 NXP Semiconductors, UJA1076TW/3V3/WD:1 Datasheet - Page 27

• Manufacturer Part Number: UJA1076TW/3V3/WD:1
• Description: IC SBC CAN HS 3.3V 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1076TW/3V3/WD:1

• Controller Type: System Basis Chip
• Interface: SPI
• Voltage - Supply: 4.5 V ~ 28 V
• Current - Supply: 82µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
8. Thermal characteristics
UJA1076_2
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, double-layer
High-speed CAN core system basis chip
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
UJA1076
© NXP B.V. 2010. All rights reserved.
015aaa137
Figure
14).
27 of 47