PIC16F716-I/SS Microchip Technology Inc., PIC16F716-I/SS Datasheet - Page 126

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PIC16F716-I/SS

Manufacturer Part Number
PIC16F716-I/SS
Description
MCU, 8-Bit, 2KW Flash, 128 RAM, 13 I/O, SSOP-20
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F716-I/SS

A/d Inputs
4-Channel, 8-Bit
Cpu Speed
5 MIPS
Eeprom Memory
0 Bytes
Input Output
13
Memory Type
Flash
Number Of Bits
8
Package Type
20-pin SSOP
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F716-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F716
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS41206B-page 124
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
E
c
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
MIN
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
Microchip Technology Drawing C04-072B
© 2007 Microchip Technology Inc.
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
φ
L

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