PMD3001D T/R NXP Semiconductors, PMD3001D T/R Datasheet
PMD3001D T/R
Specifications of PMD3001D T/R
Related parts for PMD3001D T/R
PMD3001D T/R Summary of contents
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PMD3001D MOSFET driver Rev. 02 — 28 August 2009 1. Product profile 1.1 General description NPN/PNP transistor pair connected as push-pull driver in a SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. 1.2 Features I Low V I Application-optimized pinout I ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PMD3001D 4. Marking Table 4. Type number PMD3001D PMD3001D_2 Product data sheet Pinning Description base TR1, TR2 collector TR2 collector TR2 emitter TR1, TR2 collector TR1 collector TR1 Ordering information Package Name ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor; for the PNP transistor with negative polarity V CBO V CEO Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm [3] Device mounted on a ceramic PCB duty cycle = Z 1 th(j-a) (K/W) ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) 1 (K/W) 0.75 0 0.33 0.2 0.1 0.05 10 0.02 0. FR4 PCB, mounting pad for collector 1cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = Z th(j-a) (K/ 0.5 0.33 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified amb Symbol Parameter Per NPN transistor I CBO CEsat V BEsat V BE Per PNP transistor I CBO CEsat V BEsat V BE PMD3001D_2 Product data sheet Characteristics Conditions collector-base cut-off current 150 current gain collector-emitter I = 100 mA saturation voltage I = 500 mA ...
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... NXP Semiconductors Table unless otherwise specified amb Symbol Parameter Per device off [1] Pulse test: t PMD3001D_2 Product data sheet Characteristics …continued Conditions delay time rise time turn-on time storage time fall time turn-off time 300 s; 0.02 p Rev. 02 — 28 August 2009 ...
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... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 5. TR1 (NPN): DC current gain as a function of collector current; typical values 1 (V) (1) 0.8 (2) 0.6 (3) 0 amb ( amb ( 100 C amb Fig 7. TR1 (NPN): Base-emitter voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1 V CEsat ( (1) ( 100 C amb ( amb ( amb Fig 9. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values PMD3001D_2 Product data sheet 006aaa790 V CEsat ( (mA) C (1) I (2) I (3) I Fig 10. TR1 (NPN): Collector-emitter saturation Rev. 02 — 28 August 2009 PMD3001D ...
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... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 11. TR2 (PNP): DC current gain as a function of collector current; typical values 1 (V) (1) 0.8 (2) 0.6 (3) 0 amb ( amb ( 100 C amb Fig 13. TR2 (PNP): Base-emitter voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1 V CEsat (V) 1 (1) 10 ( 100 C amb ( amb ( amb Fig 15. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values 8. Test information Fig 17. Test circuit for switching times PMD3001D_2 Product data sheet 006aaa796 V CEsat (mA) C Fig 16. TR2 (PNP): Collector-emitter saturation ...
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... NXP Semiconductors 9. Package outline Fig 18. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMD3001D [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 11. Soldering Fig 19. Reflow soldering footprint SOT457 (SC-74) 5.05 Fig 20. Wave soldering footprint SOT457 (SC-74) PMD3001D_2 Product data sheet 3.45 1.95 0.95 3.30 2.825 1.60 1.70 3.10 3.20 Dimensions in mm 5.30 1.40 4.30 Dimensions in mm Rev. 02 — 28 August 2009 ...
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... Document ID Release date PMD3001D_2 20090828 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 20 “Wave soldering footprint SOT457 PMD3001D_1 20060926 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12 Revision history ...