ISL3158AEMBZ Intersil, ISL3158AEMBZ Datasheet - Page 14

• Manufacturer Part Number: ISL3158AEMBZ
• Description: TXRX ESD 5V RS485/422 8-SOIC
• Manufacturer: Intersil
• Type: Transceiverr

Specifications of ISL3158AEMBZ

• Number Of Drivers/receivers: 1/1
• Protocol: RS422, RS485
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Die Characteristics
DIE DIMENSIONS INCLUDING 50µM SCRIBE
Interface Materials
GLASSIVATION
TOP METALLIZATION
SUBSTRATE
BACKSIDE FINISH
Assembly Related Information
SUBSTRATE POTENTIAL
Additional Information
WORST CASE CURRENT DENSITY
PROCESS
TRANSISTOR COUNT
PAD OPENING SIZE:
WAFER SIZE:
Thickness: 19 mils
1400µm x 1530µm
Sandwich TEOS and Nitride
Type: Al with 0.5% Cu
Thickness: 28kÅ
N/A
Silicon/Polysilicon/Oxide
GND (powered up)
N/A
Si GateBiCMOS, IBM P6
530
90µm x 90µm
200mm (~8 inch)
14
ISL3158AE
PAD #
TABLE 2. BOND PAD FUNCTION AND COORDINATES
10
12
11
1
2
3
4
5
6
7
8
9
A (half duplex)
A (full duplex)
FUNCTION
GND2
GND1
V
RO
RE
DE
DI
Y
Z
B
CC
562.55
574.3
684.3
(µm)
1054
1054
1054
1054
1054
99.5
99.5
99.5
99.5
X
1014.35
1004.65
1256.45
1385.35
April 3, 2009
286.75
540.45
498.3
104.7
104.7
250.6
831.1
(µm)
1308
FN6886.0
Y