LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet - Page 81

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LPC1837FET256,551

Manufacturer Part Number
LPC1837FET256,551
Description
Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
Manufacturer
NXP Semiconductors
Series
LPC18xxr

Specifications of LPC1837FET256,551

Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
 Details
Other names
935293795551
NXP Semiconductors
14. Package outline
Fig 27. Package outline LBGA256 package sot740_2
LPC1850_30_20_10
Objective data sheet
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT740-2
VERSION
OUTLINE
max
1.55
A
ball A1
index area
ball A1
index area
0.45
0.35
A
1
M
K
H
D
B
T
P
F
G
R
N
C
A
L
E
J
1.1
0.9
A
2
1
IEC
- - -
2
0.55
0.45
b
3
e
4
17.2
16.8
5
D
6
7
17.2
16.8
8
MO-192
JEDEC
E
e
D
All information provided in this document is subject to legal disclaimers.
1
9
10
1/2 e
REFERENCES
11
e
1
Rev. 1.2 — 17 February 2011
12
13
0
15
e
14
1
b
15
JEITA
16
15
e
- - -
2
scale
5
1/2 e
0.25
B
v
e
w
v
A
E
e
M
M
2
0.1
w
C
C
10 mm
A B
0.12
y
32-bit ARM Cortex-M3 microcontroller
A
0.35
y
LPC1850/30/20/10
A
1
y
2
1
C
A
1
PROJECTION
EUROPEAN
detail X
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
05-06-16
05-08-04
SOT740-2
81 of 87

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