PCF8574AP,112 NXP Semiconductors, PCF8574AP,112 Datasheet - Page 2

• Manufacturer Part Number: PCF8574AP,112
• Description: IC I/O EXPANDER I2C 8B 16DIP
• Manufacturer: NXP Semiconductors

Specifications of PCF8574AP,112

• Package / Case: 16-DIP (0.300", 7.62mm)
• Interface: I²C
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 100KHz
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Includes: POR
• Logic Family: PCF8574
• Number Of Lines (input / Output): 8.0 / 8.0
• Operating Supply Voltage: 2.5 V to 6 V
• Power Dissipation: 400 mW
• Operating Temperature Range: - 40 C to + 85 C
• Logic Type: I/O Expander
• Maximum Clock Frequency: 100 KHz
• Mounting Style: Through Hole
• Number Of Input Lines: 8.0
• Number Of Output Lines: 8.0
• Output Current: 25 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-3615 - DEMO BOARD I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1073-5; 933851670112; PCF8574APN

Philips Semiconductors
CONTENTS
1
2
3
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
7
7.1
7.2
7.3
8
9
10
11
12
13
13.1
13.2
13.2.1
13.2.2
13.3
13.3.1
13.3.2
13.3.3
13.4
14
15
16
17
2002 Nov 22
Remote 8-bit I/O expander for I
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
DIP16 and SO16 packages
SSOP20 package
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
FUNCTIONAL DESCRIPTION
Addressing
Interrupt output
Quasi-bidirectional I/Os
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
I
PACKAGE OUTLINES
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C-BUS TIMING CHARACTERISTICS
2
C COMPONENTS
2
C-BUS
2
C-bus
2
Product specification
PCF8574