PCA9600D,112 NXP Semiconductors, PCA9600D,112 Datasheet - Page 27

IC DUAL BI-DIR BUS BUFFER 8-SOIC

PCA9600D,112

Manufacturer Part Number
PCA9600D,112
Description
IC DUAL BI-DIR BUS BUFFER 8-SOIC
Manufacturer
NXP Semiconductors
Type
Bufferr
Datasheet

Specifications of PCA9600D,112

Package / Case
8-SOIC (3.9mm Width)
Mounting Type
Surface Mount
Current - Supply
7.3mA
Voltage - Supply
2.5 V ~ 15 V
Delay Time
100ns
Capacitance - Input
10pF
Tx/rx Type
I²C Logic
Supply Voltage (max)
15 V
Supply Voltage (min)
2.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935285243112::PCA9600D::PCA9600D
NXP Semiconductors
13. Abbreviations
PCA9600
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 10.
Acronym
CDM
ESD
HBM
I
I/O
IC
PMBus
SMBus
TTL
2
Fig 28. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Charged-Device Model
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Input/Output
Integrated Circuit
Power Management Bus
System Management Bus
Transistor-Transistor Logic
Rev. 5 — 5 May 2011
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Dual bidirectional bus buffer
temperature
peak
PCA9600
© NXP B.V. 2011. All rights reserved.
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time
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