UJA1069TW24/3V3:51 NXP Semiconductors, UJA1069TW24/3V3:51 Datasheet - Page 41

• Manufacturer Part Number: UJA1069TW24/3V3:51
• Description: IC LIN FAIL-SAFE 24-HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/3V3:51

• Applications: Automotive
• Interface: LIN (Local Interconnect Network)
• Voltage - Supply: 3.3V
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935280014518; UJA1069TW24/3V3-T; UJA1069TW24/3V3-T

NXP Semiconductors
8. Thermal characteristics
UJA1069_3
Product data sheet
Fig 15. Thermal model of the HTSSOP32 package
Fig 16. Thermal model of the HTSSOP24 package
V1 dissipation
V1 dissipation
Rev. 03 — 10 September 2007
6 K/W
6 K/W
6 K/W
R th(c-a)
6 K/W
R th(c-a)
V3 dissipation
V3 dissipation
23 K/W
17 K/W
T
T
T
T
case
amb
case
amb
(heat sink)
(heat sink)
001aad671
other dissipation
other dissipation
LIN fail-safe system basis chip
001aae136
6 K/W
6 K/W
T
T
vj
vj
UJA1069
© NXP B.V. 2007. All rights reserved.
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