TE28F800B3B110 Intel, TE28F800B3B110 Datasheet - Page 46

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TE28F800B3B110

Manufacturer Part Number
TE28F800B3B110
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F800B3B110

Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TE28F800B3B110
Manufacturer:
SAMSUNG
Quantity:
5 120
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
8.4
Figure 12.
Figure 13.
Table 24.
8.5
Table 25.
18 Aug 2005
46
AC I/O Test Conditions
AC Input/Output Reference Waveform
Note:
Transient Equivalent Testing Load Circuit
Note:
Test Configuration Component Values for Worst Case Speed Conditions
Device Capacitance
T
Device Capacitance
C
C
§
V
Note:
A
Sampled, not 100% tested.
IN
OUT
CCQ
Symbol
= 25 °C, f = 1 MHz
Min Standard Test
Input timing begins, and output timing ends, at V
Worst-case speed conditions are when V
See
C
V
L
0V
CCQ
Table 24
Test Configuration
includes jig capacitance.
Input
Intel
Output Capacitance
Input Capacitance
for component values.
®
Order Number: 290580, Revision: 020
Advanced Boot Block Flash Memory (B3)
Parameter
V
CCQ
/2
§
Under Test
Device
CC
C
Typ
= V
6
8
L
50
(pF)
CC
CCQ
C
L
Min.
V
/2. Input rise and fall times (10% to 90%) < 5 ns.
CCQ
R
R
1
2
Max
12
8
Out
R
1
25
(kΩ)
Unit
pF
pF
V
CCQ
/2
Output
V
V
Condition
OUT
IN
R
2
Datasheet
= 0.0 V
25
= 0.0 V
(kΩ)

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