BSS84AKW,115 NXP Semiconductors, BSS84AKW,115 Datasheet - Page 5

• Manufacturer Part Number: BSS84AKW,115
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
Table 6.
[1]
[2]
BSS84AKW
Product data sheet
Symbol
R
R
Fig 4.
Fig 5.
th(j-a)
th(j-sp)
Z
Z
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
(K/W)
(K/W)
th(j-a)
th(j-a)
10
10
10
10
10
10
1
1
3
2
3
2
10
10
FR4 PCB, standard footprint
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for drain 1 cm
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
−3
−3
Thermal characteristics
duty cycle = 1
duty cycle = 1
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to solder point
0.25
0.25
0.5
0.1
0.5
0.1
0
0
0.75
0.33
0.05
0.02
0.01
0.75
0.33
0.05
0.02
0.01
0.2
0.2
10
10
−2
−2
All information provided in this document is subject to legal disclaimers.
10
10
−1
−1
2
Rev. 1 — 23 May 2011
1
1
in free air
Conditions
50 V, 150 mA P-channel Trench MOSFET
10
10
2
[1]
[2]
.
Min
-
-
-
10
10
BSS84AKW
2
2
Typ
415
350
-
t
t
p
p
© NXP B.V. 2011. All rights reserved.
(s)
(s)
017aaa028
017aaa029
150
Max
480
400
10
10
3
3
Unit
K/W
K/W
K/W
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