SC16IS752IPW,112 NXP Semiconductors, SC16IS752IPW,112 Datasheet - Page 55

• Manufacturer Part Number: SC16IS752IPW,112
• Description: IC UART DUAL 12C/SPI 28TSSOP
• Manufacturer: NXP Semiconductors
• Type: IrDA or RS- 232 or RS- 485r

Specifications of SC16IS752IPW,112

• Number Of Channels: 2, DUART
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Features: Low Current
• Fifo's: 64 Byte
• Protocol: RS232, RS485
• Voltage - Supply: 2.5V, 3.3V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Data Rate: 5 Mbps
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.3 V
• Supply Current: 6 mA
• Maximum Operating Temperature: + 95 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 2.5 V or 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4016-5; 935279292112; SC16IS752IPW; SC16IS752IPW

NXP Semiconductors
SC16IS752_SC16IS762_7
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 40.
Table 41.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
41
39.
Dual UART with I
Rev. 07 — 19 May 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
2
SC16IS752/SC16IS762
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Figure
350 to 2000
260
250
245
39) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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