TDA8944AJ/N2,112 NXP Semiconductors, TDA8944AJ/N2,112 Datasheet - Page 15

IC AMP AUDIO PWR 7W STER 17SIL

TDA8944AJ/N2,112

Manufacturer Part Number
TDA8944AJ/N2,112
Description
IC AMP AUDIO PWR 7W STER 17SIL
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA8944AJ/N2,112

Output Type
2-Channel (Stereo)
Max Output Power X Channels @ Load
7W x 2 @ 8 Ohm
Voltage - Supply
4.5 V ~ 18 V
Features
Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
Mounting Type
Through Hole
Package / Case
17-SIL (Bent and Staggered Leads)
Operational Class
Class-AB
Audio Amplifier Output Configuration
2-Channel Stereo
Output Power (typ)
7x2@8OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.07@8Ohm@1W%
Single Supply Voltage (typ)
12V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Power Dissipation
18W
Rail/rail I/o Type
No
Single Supply Voltage (min)
4.5V
Single Supply Voltage (max)
18V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
17
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3461-5
935270284112
TDA8944AJU
Philips Semiconductors
9397 750 09433
Product data
Fig 16. Printed-circuit board layout (single-sided); components view.
14.1.2 Power supply decoupling
14.2 Thermal behaviour and heatsink calculation
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR - typical 100 nF - has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor - e.g. 1000 F or greater - must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
The measured maximum thermal resistance of the IC package, R
A calculation for the heatsink can be made, with the following parameters:
T
V
T
R
including the heatsink. In the heatsink calculations the value of R
amb
j(max)
CC
th(tot)
220
nF
= 12 V and R
220 nF
= 50 C
= 150 C
is the total thermal resistance between the junction and the ambient
1
4
4
OUT1
OUT1
1
OUT2
Rev. 01 — 01 March 2002
4.7
4.7
nF
nF
OUT2
L
= 8
220 nF
220 nF
220 nF
4
4
220 nF
100 nF
2 x 7 W BTL audio amplifier with DC gain control
10 F
IN2
IN2
IN1
IN1
1000 F
MODE
SVR
GC
SGND
V CC
GND
ON
MGW607
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
TDA8944AJ
th(j-mb)
th(mb-h)
is 4.5 K/W.
is ignored.
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